EP3SL340F1517I4LN

The EP3SL340F1517I4LN is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel designed for high-density programmable logic implementations. With 337,500 logic elements, abundant embedded memory and a large I/O count, it addresses designs that require substantial on-chip logic capacity and extensive external interfacing.

Engineered for surface-mount deployment in a 1517-BBGA (FCBGA) package and specified for industrial temperature operation, this device suits applications where integration density, high I/O, and wide operating temperature range are key considerations.

Key Features

• FPGA Core Stratix® III L family Field Programmable Gate Array IC optimized for large-scale programmable logic designs.
• Logic Capacity 337,500 logic elements to implement complex custom logic, state machines, and data-paths on a single device.
• Embedded Memory Approximately 18.8 Mbits of embedded memory (18,822,144 bits) for buffering, packet processing, and on-chip data storage.
• I/O Density 976 I/O pins to support high-pin-count interfaces, multi-channel connectivity, and dense board-level routing.
• Power Core supply range from 0.86 V to 1.15 V to match system power architectures requiring low-voltage core operation.
• Package & Mounting 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40), designed for surface-mount assembly.
• Operating Range Industrial-grade operating temperature from -40 °C to 100 °C for reliable performance in temperature-demanding environments.
• Compliance RoHS compliant for regulatory and environmental compatibility.

Typical Applications

• High-density digital systems — Implements large logic functions and complex processing pipelines using hundreds of thousands of logic elements and on-chip memory.
• Multi-channel interface hubs — Supports designs requiring extensive external connectivity with 976 I/O pins for parallel or multiplexed interfaces.
• Industrial control and automation — Industrial temperature rating and robust package options make it suitable for control systems that require sustained operation across a wide temperature range.

Unique Advantages

• Substantial logic resources: 337,500 logic elements enable consolidation of multiple functions onto a single FPGA, reducing board-level component count.
• Significant on-chip memory: Approximately 18.8 Mbits of embedded memory supports buffering and local data storage without external RAM.
• Very high I/O count: 976 I/Os simplify routing for systems with many peripherals or high channel counts, minimizing the need for external multiplexers or expanders.
• Industrial temperature capability: Rated from -40 °C to 100 °C to meet environmental demands in industrial and similarly demanding deployments.
• Surface-mount BGA packaging: 1517-BBGA (1517-FBGA, 40×40) enables compact board layouts while supporting high-density pin assignments.
• RoHS compliance: Facilitates use in designs that must meet common environmental directives.

Why Choose EP3SL340F1517I4LN?

The EP3SL340F1517I4LN combines very large logic capacity, multi-megabit embedded memory, and a high I/O count in a surface-mount FCBGA package, making it a strong choice for engineers aiming to integrate complex digital functions on a single FPGA. Its industrial temperature rating and RoHS compliance add practical value for long-term, deployable designs.

This device is well suited to teams building high-density programmable systems that require scalable logic resources, extensive external interfacing, and reliable operation across a wide temperature range. Leveraging these characteristics can simplify system architecture, reduce BOM complexity, and support robust deployments.

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