EP3SL340F1517I4N

The EP3SL340F1517I4N is a Stratix® III L field-programmable gate array (FPGA) offered by Intel, delivering a large programmable fabric with substantial embedded memory and high I/O density. It is packaged in a 1517-FBGA (40×40) surface-mount FCBGA and specified for industrial-grade operating conditions.

This device suits designs that require significant logic capacity, abundant on-chip memory, and many I/O signals while operating across a wide temperature range and within a core voltage window of 0.86–1.15 V.

Key Features

• Programmable Logic Capacity — 337,500 logic elements provide extensive on-chip resources for complex custom logic, protocol engines, and parallel datapaths.
• Embedded Memory — Approximately 18.8 Mbits of total RAM bits for buffering, state storage, and memory-intensive functions.
• High I/O Count — 976 I/O pins enable wide external interfacing for multi-channel systems, high-speed buses, and extensive peripheral connectivity.
• Power Supply Range — Core voltage supply specified from 860 mV to 1.15 V to match system power architecture and enable optimized power delivery.
• Package & Mounting — 1517-FBGA (40×40) FCBGA package in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C and designated Industrial grade for temperature-critical applications.
• Regulatory Status — RoHS compliant.

Typical Applications

• High-performance signal processing: Use the large logic array and embedded memory to implement custom DSP pipelines and parallel processing engines.
• Network and communications equipment: Leverage the high I/O count and programmable fabric for protocol handling, packet processing, and interface bridging.
• Industrial control and automation: Deploy in control platforms requiring robust operation across −40 °C to 100 °C and extensive I/O connectivity for sensors and actuators.
• Test and measurement systems: Apply the device’s memory and logic resources for data acquisition, real-time preprocessing, and custom measurement algorithms.

Unique Advantages

• Large programmable fabric: 337,500 logic elements enable integration of complex functions on a single device, reducing BOM and inter-chip communication.
• Substantial on-chip memory: Approximately 18.8 Mbits of embedded RAM supports buffering, LUT-based storage, and state machines without external memory.
• Extensive I/O capability: 976 I/Os accommodate high-channel-count interfaces and multiple peripheral standards on the same FPGA.
• Industrial-grade thermal tolerance: −40 °C to 100 °C operating range supports deployments in demanding temperature environments.
• Compact FCBGA packaging: 1517-FBGA (40×40) surface-mount package provides a dense footprint for space-constrained boards.
• Controlled core-voltage range: 0.86–1.15 V supply specification enables integration with tailored power systems for optimized efficiency.

Why Choose EP3SL340F1517I4N?

The EP3SL340F1517I4N delivers a balance of large-scale logic, substantial embedded memory, and high I/O density in an industrial-grade FPGA package. Its combination of 337,500 logic elements, roughly 18.8 Mbits of on-chip RAM, and 976 I/Os makes it suitable for complex, I/O-intensive designs that must operate across a wide temperature range.

Designed for engineers and procurement teams seeking a high-capacity programmable device in a compact FCBGA package, this Intel Stratix® III L FPGA provides scalable on-board integration to consolidate functions and simplify system architecture while adhering to industrial environmental requirements.

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