EP3SL340F1760C3

The EP3SL340F1760C3 is a Stratix® III L field programmable gate array (FPGA) in a 1760-FCBGA package. It provides substantial on-chip logic and I/O resources for designs that require high logic capacity and large external interfacing.

With 337,500 logic elements, approximately 18.8 Mbits of embedded memory and 1,120 I/Os, the device is positioned for complex digital designs that benefit from dense integration, significant embedded RAM, and a compact, high-pin-count surface-mount package.

Key Features

• Core Logic — 337,500 logic elements to implement large, custom digital logic functions within a single device.
• Embedded Memory — Approximately 18.8 Mbits of on-chip RAM to support buffering, FIFOs, and local storage without immediate dependence on external memory.
• I/O Capacity — 1,120 available I/Os to support extensive peripheral and multi-device interfacing.
• Power — Core voltage supply range of 860 mV to 1.15 V to match low-voltage system designs.
• Package — 1760-FCBGA (42.5 × 42.5 mm) package case providing a high pin count in a surface-mount form factor.
• Mounting & Grade — Surface-mount device with commercial-grade operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for environmental and regulatory considerations.

Typical Applications

• High-density digital processing — Use the large logic element count to implement complex state machines, datapaths, and custom accelerators.
• Multi-channel I/O systems — Leverage 1,120 I/Os for designs requiring broad external connectivity or multiple parallel interfaces.
• On-chip memory buffering — Approximately 18.8 Mbits of embedded RAM are useful for data buffering, packet queues, and local storage to reduce external memory dependency.
• Compact, high-pin-count boards — The 1760-FCBGA package enables dense board-level integration where a high pin count and surface-mount packaging are required.

Unique Advantages

• Large integrated logic capacity: 337,500 logic elements allow consolidation of multiple functions into a single FPGA, reducing system complexity.
• Substantial on-chip RAM: Approximately 18.8 Mbits of embedded memory minimizes the need for external RAM in many buffering and storage use cases.
• Extensive I/O availability: 1,120 I/Os simplify external interfacing and reduce the requirement for additional I/O expanders.
• Low-voltage core support: Core supply range of 860 mV to 1.15 V aligns with modern low-voltage power domains.
• High-pin-count FCBGA packaging: The 1760-FCBGA (42.5 × 42.5 mm) package supports dense, high-performance board designs while remaining surface-mount compatible.
• RoHS compliant: Meets lead-free, hazardous substance guidelines for environmental and regulatory considerations.

Why Choose EP3SL340F1760C3?

The EP3SL340F1760C3 combines very large logic capacity, significant embedded memory, and extensive I/O in a single, surface-mount 1760-FCBGA package. Its specifications make it well suited to designs that need to integrate complex digital functions and high-channel connectivity while operating within a commercial temperature range.

This device is a strong fit for engineering teams seeking a high-density FPGA solution that supports consolidation of system functions, reduces board-level component count, and provides the on-chip resources necessary for scalable, integrated digital designs.

Request a quote or submit your design requirements to receive pricing and availability for EP3SL340F1760C3.