EP3SL340F1760C4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 729 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 1120 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13500 | Number of Logic Elements/Cells | 337500 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 18822144 |
Overview of EP3SL340F1760C4G – Field Programmable Gate Array (FPGA) IC
The EP3SL340F1760C4G is a commercial-grade FPGA from Intel’s Stratix III family, designed for high-performance logic, digital signal processing (DSP), and embedded system integration. It combines a dense configurable fabric with abundant I/O and on-chip memory to address complex, memory‑intensive designs.
Key device-level specifications include 337,500 logic elements, approximately 18.8 Mbits of embedded memory, and 1,120 user I/O pins in a 1760-FCBGA (42.5 × 42.5 mm) package. The device supports a selectable core voltage range of 0.86 V to 1.15 V and operates across a commercial temperature range of 0 °C to 85 °C.
Key Features
- Core density — 337,500 logic elements provide scalable programmable logic capacity for large designs and complex datapaths.
- Embedded memory — Approximately 18.8 Mbits of on-chip RAM for frame buffers, FIFOs, and memory-centric functions.
- High pin count I/O — 1,120 user I/O pins arranged for flexible interfacing with external devices and memory.
- Package and mounting — 1760-FCBGA (42.5 × 42.5 mm) package with surface-mount assembly for compact board-level integration.
- Power and core voltage — Core supply range from 0.86 V to 1.15 V to support selectable performance/power trade-offs.
- Commercial temperature grade — Rated for 0 °C to 85 °C operation, suitable for mainstream electronics applications.
- Stratix III family features — Family-level capabilities include selectable core voltage, Programmable Power Technology, high-speed DSP blocks (supporting 9×9 to 36×36 multipliers), up to 12 PLLs, and extensive clock resources.
- Security and reliability — Family support for 256-bit AES encryption, on-chip configuration memory CRC and ECC for enhanced design protection and error detection/correction.
- Standards and interfaces — Family supports high-speed external memory interfaces and common networking standards to simplify system integration.
- Compliance — RoHS compliant.
Typical Applications
- High-performance logic and compute — Implement complex control and processing pipelines where high logic density and large distributed logic are required.
- Digital signal processing (DSP) — Use the family’s DSP resources and embedded memory for filtering, multi-rate processing, and accelerated math functions.
- Memory interface and protocol bridges — Leverage abundant I/O and on-chip memory to build memory controllers and protocol translation engines.
- Networking and communications — Implement packet processing, protocol offload, and high-speed I/O interfaces supported by the Stratix III feature set.
Unique Advantages
- High logic capacity: 337,500 logic elements enable large, integrated designs without immediate migration to multi-device solutions.
- Substantial embedded memory: Approximately 18.8 Mbits of on-chip RAM reduces external memory dependence for many buffering and storage tasks.
- Extensive I/O connectivity: 1,120 user I/O pins support dense external interfacing for memory, sensors, and high-speed links.
- Flexible power/performance trade-offs: Core voltage range of 0.86 V–1.15 V and family Programmable Power Technology enable tuning for power-sensitive or performance-critical designs.
- Integrated reliability and security: Built-in CRC, ECC, and support for 256-bit AES keys help protect configuration data and improve system availability.
- Surface-mount FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) provides a compact footprint for high-density board layouts.
Why Choose EP3SL340F1760C4G?
The EP3SL340F1760C4G positions itself as a high-capacity, commercially rated Stratix III FPGA suitable for designers who need substantial logic resources, embedded memory, and large I/O counts in a single device. Its combination of core density, memory, and family-level DSP and clocking features supports demanding logic, DSP, and interfacing tasks while allowing designers to balance performance and power through selectable core voltage.
This device is appropriate for teams building memory‑centric processing blocks, protocol and interface controllers, or high-throughput signal processing subsystems that benefit from a mature FPGA architecture and integrated reliability/security features.
Request a quote or submit an inquiry to check availability and pricing for EP3SL340F1760C4G and to discuss how it can fit your next design.

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