EP3SL340F1760C4N

The EP3SL340F1760C4N is a Stratix® III L Field Programmable Gate Array (FPGA) supplied in a 1760-FCBGA package. It delivers very large logic capacity, extensive embedded memory, and a high I/O count for complex digital designs and board-level systems that require dense programmable logic integration.

With a broad logic element budget, approximately 18.8 Mbits of on-chip RAM and up to 1,120 I/Os, this device targets high-density logic implementations, systems needing substantial I/O connectivity, and applications where package-level integration and surface-mount mounting are required.

Key Features

• Logic Capacity — 337,500 logic elements to support large-scale combinational and sequential designs.
• Embedded Memory — Approximately 18.8 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Resources — 1,120 I/Os to enable extensive board-level interfacing and parallel connectivity.
• Package & Mounting — 1760-BBGA / 1760-FCBGA (42.5 × 42.5 mm) surface-mount package for high-density PCB assembly.
• Power Supply — Core voltage range from 860 mV to 1.15 V to match system power-rail requirements.
• Operating Grade & Temperature — Commercial grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High-density logic designs — Large FPGA fabric supports complex digital functions, state machines, and custom accelerators.
• High I/O systems — Up to 1,120 I/Os accommodates extensive sensor arrays, parallel data buses, and board-level interfaces.
• Embedded memory-dependent designs — Approximately 18.8 Mbits of on-chip RAM for buffering, packet storage, and real-time data handling.
• Compact system integration — 1760-FCBGA surface-mount package enables compact, high-density PCB layouts for space-constrained applications.

Unique Advantages

• Substantial logic resources: 337,500 logic elements provide headroom for feature-rich designs and multi-function implementations.
• Significant on-chip RAM: Approximately 18.8 Mbits of embedded memory reduces dependency on external RAM for many buffering and storage tasks.
• Very high I/O count: 1,120 I/Os simplify integration with multiple peripherals and high-bandwidth interfaces without extensive external multiplexing.
• Compact, board-ready package: 1760-FCBGA (42.5 × 42.5 mm) supports surface-mount assembly for modern PCB manufacturing flows.
• Controlled core voltage range: 860 mV to 1.15 V allows integration with contemporary power-rail architectures.
• RoHS compliant: Meets modern environmental requirements for reduced hazardous substances.

Why Choose EP3SL340F1760C4N?

The EP3SL340F1760C4N positions itself as a high-capacity, integration-focused Stratix® III L FPGA for applications that demand large logic budgets, extensive embedded memory, and high I/O density in a single surface-mount package. Its commercial-grade operating range and RoHS compliance make it suitable for a wide range of board-level electronic systems.

Designers seeking to consolidate complex digital functions, reduce external memory needs, and streamline board-level connectivity will find this device well suited to scalable implementations where logic capacity, I/O count, and package integration are primary selection criteria.

Request a quote or submit a pricing inquiry to get started with EP3SL340F1760C4N for your next high-density FPGA design.