EP3SL340F1760I4

The EP3SL340F1760I4 is a Stratix® III L field programmable gate array (FPGA) from Intel, offered in a 1760-FCBGA package (42.5 × 42.5 mm) and designed for surface-mount assembly. This device provides 337,500 logic elements and approximately 18.8 Mbits of embedded memory, alongside 1,120 user I/O pins, making it suited to designs that require high logic capacity and substantial on-chip RAM.

Operating over a core supply range of 860 mV to 1.15 V and specified for an industrial temperature range of −40 °C to 100 °C, the EP3SL340F1760I4 is RoHS compliant and presented in a 1760-BBGA FCBGA package for dense board integration.

Key Features

• Core Capacity — 337,500 logic elements provide large programmable logic resources for complex digital implementations.
• Embedded Memory — Approximately 18.8 Mbits of on-chip RAM for data buffering, state machines, and temporary storage without external memory.
• I/O Density — 1,120 user I/O pins to support extensive peripheral connections and system interfacing.
• Power — Core voltage supply specified from 860 mV to 1.15 V to match low-voltage system architectures.
• Package & Mounting — 1760-FCBGA (42.5 × 42.5 mm) package in a surface-mount format for compact, high-density board layouts.
• Operating Range & Grade — Industrial grade device rated for −40 °C to 100 °C operation.
• Environmental Compliance — RoHS compliant.

Unique Advantages

• High logic integration: 337,500 logic elements support large-scale FPGA designs and reduce the need for multiple devices.
• Substantial on-chip memory: Approximately 18.8 Mbits of embedded RAM minimizes reliance on external memory for many applications.
• Extensive I/O count: 1,120 I/O pins allow for broad peripheral connectivity and flexible system partitioning.
• Industrial temperature rating: −40 °C to 100 °C specification supports deployment in temperature-challenging environments.
• Compact, high-density package: 1760-FCBGA (42.5 × 42.5 mm) enables dense PCB integration while maintaining a large resource set.
• Regulatory compliance: RoHS compliance aids in meeting environmental requirements for modern electronics manufacturing.

Why Choose EP3SL340F1760I4?

The EP3SL340F1760I4 combines a large logic fabric (337,500 logic elements), significant embedded memory (approximately 18.8 Mbits), and a high I/O count (1,120 pins) in a single 1760-FCBGA surface-mount package, offering a compact platform for complex digital designs. Its industrial temperature rating and wide core voltage range make it suitable for applications requiring reliable operation across varied conditions.

This Intel-manufactured Stratix® III L FPGA is aimed at teams and projects that need substantial on-chip resources and dense I/O in a single device, providing a clear path to integrate large logic functions and memory into space-constrained boards while adhering to RoHS requirements.

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