EP3SL340F1760I4L

The EP3SL340F1760I4L is a Stratix® III L Field Programmable Gate Array (FPGA) IC designed for demanding embedded and system-level applications. It integrates a high density of programmable logic and on-chip memory with a large I/O count to support complex digital designs.

Key on-device resources include 337,500 logic elements, approximately 18.8 Mbits of embedded memory, and 1,120 I/O pins. The device ships in a 1760-FCBGA (42.5×42.5 mm) surface-mount package, supports a core voltage range of 0.86 V to 1.15 V, and is specified for industrial temperature operation from −40 °C to 100 °C.

Key Features

• High-density core  337,500 logic elements provide extensive programmable logic for complex functions and parallel processing.
• On-chip memory  Approximately 18.8 Mbits of embedded RAM (18,822,144 bits) for buffering, FIFOs, and local data storage.
• Large I/O capacity  1,120 user I/O pins to accommodate wide bus interfaces, multi-channel I/O, and dense board-level connectivity.
• Power and voltage  Core supply range from 0.86 V to 1.15 V to match system power-rail designs and enable lower-voltage operation.
• Package and mounting  1760-FCBGA (42.5×42.5 mm) in a surface-mount 1760-BBGA/FCBGA package for high I/O density and compact board integration.
• Industrial temperature grade  Specified operating range of −40 °C to 100 °C for deployment in industrial environments.
• RoHS compliant  Manufactured to meet RoHS environmental requirements.

Unique Advantages

• High logic capacity: 337,500 logic elements support large-scale, parallelizable designs without immediate need for external logic expansion.
• Substantial on-chip memory: Approximately 18.8 Mbits of embedded RAM reduces dependence on external memory for intermediate storage and buffering.
• Extensive I/O support: 1,120 I/O pins enable dense peripheral connectivity and multi-channel interfaces on a single device.
• Industrial robustness: Rated for −40 °C to 100 °C operation to meet temperature demands of industrial deployments.
• Compact, high-density package: 1760-FCBGA package delivers high pin count in a compact 42.5×42.5 mm footprint for space-constrained PCBs.
• Regulatory compatibility: RoHS compliance supports environmental stewardship and simplifies regulatory considerations.

Why Choose EP3SL340F1760I4L?

The EP3SL340F1760I4L positions itself as a high-capacity, industrial-grade FPGA suited to complex embedded systems that require substantial logic, memory, and I/O resources in a single device. Its combination of 337,500 logic elements, approximately 18.8 Mbits of on-chip RAM, and 1,120 I/O pins makes it appropriate for designs that demand integration and density.

This device is suited for engineers and procurement teams seeking a robust, RoHS-compliant FPGA in a 1760-FCBGA package, with a core voltage range and temperature specification that support a variety of industrial deployments. Its specification set supports scalability and long-term application use where integrated logic and memory resources are critical.

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