EP3SL340H1152C2

The EP3SL340H1152C2 is a Stratix® III L field programmable gate array (FPGA) IC from Intel designed for commercial applications. It delivers high logic capacity and substantial on-chip memory with a surface-mount 1152-BBGA (supplier package: 1152-HBGA, 40×40) footprint for dense system integration.

With 337,500 logic elements, approximately 18 Mbits of embedded memory, and 744 I/Os, this device targets designs that require large programmable logic fabrics, high I/O density, and a compact board-level package while operating within a standard commercial temperature range.

Key Features

• Core Architecture 
  Stratix® III L FPGA family in a high-density configuration delivering 337,500 logic elements for complex programmable logic implementations.
• Embedded Memory 
  Approximately 18 Mbits (18,822,144 bits) of on-chip RAM to support data buffering, state storage, and memory-intensive logic functions.
• I/O Capacity 
  744 available I/Os to accommodate wide parallel interfaces, multiple peripherals, and high-pin-count system designs.
• Power Supply 
  Core voltage supply range of 860 mV to 1.15 V to match system power rails and optimize core performance within specified limits.
• Package & Mounting 
  1152-BBGA FCBGA surface-mount package (supplier device package: 1152-HBGA, 40×40) for compact, high-density PCB layouts.
• Operating Range & Grade 
  Commercial-grade device rated for operation from 0 °C to 85 °C, suitable for standard commercial environments.
• Regulatory 
  RoHS compliant.

Unique Advantages

• High logic integration: 337,500 logic elements enable consolidation of large functional blocks into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 18 Mbits of embedded RAM provides local storage for buffering, lookup tables, and state machines without external memory dependencies.
• Extensive I/O density: 744 I/Os support multi-channel interfacing and flexible connectivity options for demanding peripheral and bus requirements.
• Compact board footprint: 1152-BBGA / 1152-HBGA (40×40) packaging allows high-density integration in space-constrained designs.
• Commercial suitability: Specified operating range of 0 °C to 85 °C and commercial grade make it appropriate for mainstream electronic products and prototypes.
• Standards-compliant manufacturing: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose EP3SL340H1152C2?

The EP3SL340H1152C2 combines a high logic element count, significant embedded memory, and wide I/O capacity in a compact surface-mount BBGA package, positioning it for complex commercial FPGA applications that require dense programmable logic and substantial on-chip resources. As a Stratix® III L device from Intel, it offers a scalable option for designs that need to integrate large logic functions while maintaining a compact PCB footprint.

This part is suited to engineers and procurement teams building high-density programmable solutions where logic capacity, embedded RAM, and I/O count are primary selection criteria. Its commercial-grade rating and RoHS compliance support mainstream product deployment and manufacturing processes.

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