EP3SL340H1152C3N

The EP3SL340H1152C3N is a Stratix® III L Field Programmable Gate Array (FPGA) in a 1152-BBGA (FCBGA) package designed for high-density programmable logic applications. It combines a large logic fabric with substantial on-chip memory and extensive I/O to address designs that require high integration and flexible system interfacing.

Device-level documentation for the Stratix III family describes architecture-level features such as embedded memory blocks, DSP resources, multi-track interconnect and advanced I/O structures, making this device suitable for designs that need scalable programmable logic and system-level configurability.

Key Features

• Logic Capacity — 337,500 logic elements providing a high-density fabric for complex digital designs.
• Embedded Memory — Approximately 18.8 Mbits of on-chip RAM to support memory-intensive functions and buffering.
• I/O Resources — 744 device I/O pins to support wide parallel interfaces and multiple external connections.
• Core Voltage Range — Core supply range from 0.86 V to 1.15 V to match system power architectures.
• Package & Mounting — 1152-BBGA (supplier package: 1152-HBGA, 40×40); surface-mount package for compact board-level integration.
• Operating Temperature & Grade — Commercial grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant.
• Architecture-Level Features (series-level) — Device handbook references TriMatrix embedded memory blocks, DSP blocks, clock networks and PLLs, I/O banks and high-speed differential I/O interfaces with DPA, JTAG boundary-scan, configuration and remote system upgrade capabilities, SEU mitigation and programmable power.

Typical Applications

• High-density digital processing — Use the large logic element count and DSP-capable architecture for compute-heavy, custom datapath implementations.
• Memory-intensive designs — Embedded memory (approximately 18.8 Mbits) supports buffering, packet storage and lookup tables within the fabric.
• Multi-channel I/O systems — 744 I/O pins enable wide parallel interfaces, multi-port peripherals, and complex board-level I/O routing.
• System integration and prototyping — The combination of logic, memory and architecture-level features supports rapid development of integrated digital subsystems.

Unique Advantages

• High logic density: 337,500 logic elements let you implement large-scale custom logic without immediate partitioning across multiple devices.
• Substantial on-chip memory: Approximately 18.8 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O: 744 I/O pins provide flexibility for interfacing to parallel buses, external peripherals and multi-lane systems.
• Compact surface-mount package: 1152-BBGA (40×40 supplier package) supports dense PCB layouts while maintaining broad connectivity.
• Documented architecture: Stratix III device handbook details embedded memory, DSP blocks, clocking, I/O structure and configuration features to aid system design and verification.
• Commercial-temperature suitability: Rated 0 °C to 85 °C for typical commercial deployments.

Why Choose EP3SL340H1152C3N?

The EP3SL340H1152C3N positions itself as a high-capacity Stratix III L FPGA option for engineers who need a balance of large logic resources, significant embedded memory, and a high I/O count in a compact surface-mount footprint. Its documented architecture-level capabilities—covering memory, DSP resources, clocking and I/O—support complex system-level designs that require programmable flexibility.

This device is suitable for teams designing commercial-temperature electronic systems that demand on-chip memory, dense logic implementation and broad interfacing options, with device-level documentation available in the Stratix III Device Handbook to support development and integration.

Request a quote or submit a sales inquiry to check availability, lead times and pricing for the EP3SL340H1152C3N.