EP3SL340H1152C4

The EP3SL340H1152C4 is a Stratix® III L field programmable gate array (FPGA) from Intel designed for high-capacity, I/O-rich designs. It provides a large logic fabric and substantial embedded memory to implement complex digital functions and extensive interfacing on a single device.

Targeted at commercial applications, this surface-mount FCBGA device delivers a combination of logic density, embedded RAM, and a high I/O count for systems that require consolidated programmable logic and board-level integration.

Key Features

• Logic Capacity — 337,500 logic elements to implement large-scale combinational and sequential logic designs.
• Logic Array Blocks (LABs) — 13,500 LABs to structure and organize logic resources across the device.
• Embedded Memory — Approximately 18.8 Mbits of on-chip RAM for buffering, FIFOs, and distributed storage.
• I/O Resources — 744 I/O pins to support broad external interfacing and multiple parallel connections.
• Power and Core Voltage — Core voltage range of 0.860 V to 1.15 V for compatibility with low-voltage system rails.
• Package and Mounting — 1152-BBGA FCBGA package (supplier device package: 1152-HBGA, 40×40) in a surface-mount form factor for compact board-level integration.
• Temperature Rating — Commercial operating range of 0 °C to 85 °C to match standard commercial deployment environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Telecommunications and Networking — Implement protocol processing, packet handling, and interface bridging using the device’s large logic capacity and extensive I/O.
• High-Density Control Systems — Consolidate complex control and sequencing logic into a single FPGA for industrial-style automation and control platforms within commercial temperature ranges.
• Data Aggregation and Signal Processing — Use the embedded memory and abundant logic to buffer and preprocess data streams before handoff to downstream systems.
• Prototyping and System Integration — Leverage the device’s logic and I/O resources for board-level prototypes and designs that require rapid iteration and integration of multiple functions.

Unique Advantages

• High Logic Density: 337,500 logic elements provide capacity for large, complex designs without partitioning across multiple devices.
• Substantial Embedded Memory: Approximately 18.8 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O Headroom: 744 I/Os support numerous peripheral connections and parallel interfaces, simplifying board routing and system architecture.
• Compact FCBGA Package: 1152-BBGA / 1152-HBGA (40×40) packaging enables a compact footprint for high-density board designs.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for standard commercial deployments.
• Low-Voltage Core Compatibility: Core supply range of 0.860 V to 1.15 V aligns with modern low-voltage system designs.

Why Choose EP3SL340H1152C4?

The EP3SL340H1152C4 combines a large logic fabric, significant embedded memory, and a very high I/O count in a compact surface-mount FCBGA package, making it well suited for commercial designs that demand consolidated programmable logic and broad interfacing. As a Stratix® III L device from Intel, it offers a clear specification set for engineers targeting large-scale FPGA implementations within a commercial temperature range.

Choose this part when you need high logic capacity, substantial on-chip RAM, and extensive I/O in a single-component solution to simplify board design and reduce component count.

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