EP3SL340H1152C4L

The EP3SL340H1152C4L is a Stratix® III L Field Programmable Gate Array in a 1152-ball FCBGA/HBGA package intended for commercial applications. It delivers large on-chip logic and memory resources alongside a high I/O count for dense, system-level integration.

Key hardware attributes include 337,500 logic elements, approximately 18.8 Mbits of embedded memory, 744 I/Os, and a 860 mV to 1.15 V core supply range, packaged for surface-mount assembly and RoHS compliance.

Key Features

• Core Logic 337,500 logic elements and 13,500 logic array blocks provide substantial capacity for complex digital designs and high-density logic implementation.
• Embedded Memory Approximately 18.8 Mbits of on-chip RAM supports buffering, FIFOs, and intermediate data storage without external memory in many use cases.
• I/O and Packages 744 user I/Os and a 1152-ball BGA/FCBGA (supplier package 1152-HBGA, 40×40 mm) enable high-pin-count system interfaces and dense board layouts.
• Power Core supply range from 860 mV to 1.15 V allows integration into systems with low-voltage core rails and modern power architectures.
• Temperature and Mounting Commercial-grade operating range from 0 °C to 85 °C and surface-mount package support standard PCB assembly flows.
• Regulatory RoHS compliant for lead-free assembly and regulatory alignment in commercial products.

Typical Applications

• Complex digital systems Use the large logic capacity and abundant I/Os to implement multi-function digital designs that consolidate functions into a single device.
• High-density I/O interfaces 744 I/Os support routing to multiple high-pin-count peripherals, daughtercards, or mezzanine modules in compact board layouts.
• On-chip buffering and data handling Approximately 18.8 Mbits of embedded memory supports local buffering, packet queues, and intermediate data processing.
• Prototyping and integration The combination of logic elements, memory, and I/O makes this FPGA suitable for system prototyping and integration where consolidation reduces BOM complexity.

Unique Advantages

• High logic density: 337,500 logic elements enable implementation of large, complex logic functions within a single FPGA, reducing the need for multiple devices.
• Substantial embedded memory: Approximately 18.8 Mbits of on-chip RAM minimizes external memory dependencies for many buffering and temporary storage tasks.
• Extensive I/O capability: 744 user I/Os provide flexibility for interfacing multiple peripherals and high-pin-count system designs.
• Compact, surface-mount package: 1152-ball BGA/FCBGA (1152-HBGA, 40×40) supports dense PCB designs and automated assembly processes.
• Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for a wide range of commercial applications.
• Tight core-voltage specification: Operates from 860 mV to 1.15 V, enabling integration into modern low-voltage power architectures.

Why Choose EP3SL340H1152C4L?

The EP3SL340H1152C4L combines large logic capacity, significant embedded memory, and a high I/O count in a compact 1152-ball BGA package, making it a practical choice for designers who need to consolidate complex digital functions and interfaces onto a single commercial-grade FPGA. Its power and temperature specifications align with contemporary low-voltage systems and standard commercial operating environments.

This device is well suited for engineering teams looking to reduce board-level complexity, lower BOM counts, and accelerate integration by leveraging abundant on-chip resources in a surface-mount form factor with RoHS compliance.

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