EP3SL340H1152I3

The EP3SL340H1152I3 is a Stratix® III L Field Programmable Gate Array (FPGA) in a 1152-BBGA (FCBGA) package. It provides a high logic-element count and extensive I/O in a surface-mount BGA form factor.

With 337,500 logic elements, approximately 18.8 Mbits of embedded memory, 744 I/O pins, an operating voltage range of 860 mV to 1.15 V, and an industrial temperature rating of -40 °C to 100 °C, this device targets industrial and high-density embedded designs that require broad integration and robust thermal tolerance.

Key Features

• Core Logic 337,500 logic elements provide large-scale programmable logic capacity for complex designs.
• Embedded Memory Approximately 18.8 Mbits of on-chip RAM for buffering, data storage, and intermediate processing.
• I/O Density 744 user I/O pins support extensive interfacing and high signal-count designs.
• Power Supply Operates across a supply range of 860 mV to 1.15 V to match system power architectures.
• Package & Mounting 1152-BBGA (FCBGA) package in a 1152-HBGA (40×40) supplier device package, designed for surface-mount PCB assembly.
• Temperature Range Industrial operating temperature from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory RoHS compliant for reduced hazardous substance content.

Typical Applications

• Industrial Control High logic capacity and industrial temperature rating make this FPGA suitable for control systems and automation equipment requiring reliable operation across temperature extremes.
• Signal Processing Large numbers of logic elements and substantial embedded memory support implementations of data buffering, preprocessing, and mid-level signal processing tasks.
• High-Density I/O Systems With 744 I/O pins, the device fits applications that need broad peripheral interfacing or complex protocol bridging.

Unique Advantages

• High Logic Integration: 337,500 logic elements enable consolidation of multiple functions onto a single device, reducing overall system component count.
• Substantial On-Chip Memory: Approximately 18.8 Mbits of embedded RAM allow significant local data storage for buffering and intermediate processing without external memory.
• Extensive I/O Availability: 744 I/O pins provide flexibility to connect many peripherals or high-pin-count interfaces directly to the FPGA.
• Industrial Thermal Tolerance: Rated from -40 °C to 100 °C to support designs exposed to wide operating temperatures.
• Compact Surface-Mount BGA: The 1152-BBGA (FCBGA) package offers a dense, PCB-friendly form factor for space-constrained designs.
• RoHS Compliant: Meets RoHS requirements for reduced hazardous materials in manufacturing.

Why Choose EP3SL340H1152I3?

The EP3SL340H1152I3 combines a very large logic element count, significant embedded memory, and high I/O density in a compact surface-mount BGA package, making it a practical choice for industrial and high-density embedded systems. Its wide operating temperature range and RoHS compliance support deployment in demanding environments where reliability and regulatory considerations matter.

This device is well suited to designers and integrators who require extensive on-chip resources and many external interfaces within an industrial-grade FPGA offering, enabling consolidation of functions and potential reduction of board-level complexity.

Request a quote or submit an inquiry today to get pricing and availability information for the EP3SL340H1152I3. Our team can provide details to help evaluate this device for your next design.