EP3SL340H1152I3G

The EP3SL340H1152I3G is an Intel Stratix III family FPGA offering high logic density and extensive on-chip memory for advanced digital designs. Engineered for demanding embedded, DSP and communications applications, the device combines large programmable logic resources with rich I/O and family-level features for high-performance system integration.

Key Features

• Logic Capacity — 337,500 logic elements provide substantial programmable resources for complex state machines, custom accelerators, and wide datapaths.
• Embedded Memory — Approximately 18.8 Mbits of on-chip RAM (18,822,144 total RAM bits) for large buffers, FIFOs and memory-mapped logic.
• I/O and Interface Flexibility — 744 user I/O pins support a broad range of external interfaces and modular I/O bank designs.
• Clocking and PLLs — Family features include multiple global, regional and peripheral clocks and up to 12 phase-locked loops (PLLs) for flexible clock management and synthesis.
• High-speed DSP Capability — Stratix III family DSP blocks and multiplier resources are provided for arithmetic- and signal-processing functions (family-level feature).
• Power and Core Voltage — Operates across a selectable core voltage range of 860 mV to 1.15 V, supporting power/performance trade-offs.
• Package and Mounting — Surface-mount 1152-ball BGA package options listed as 1152-BBGA / FCBGA; supplier device package noted as 1152-HBGA (40×40).
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Reliability and Security (Family Features) — Stratix III family includes configuration memory CRC, optional AES encryption for bitstream protection, and ECC support for on-chip memory (family-level).
• Standards and External Memory Support (Family Features) — Family architecture supports high-speed external memory interfaces and industry communications standards (family-level capabilities).
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• High-performance Signal Processing — Use the large logic fabric and substantial embedded memory for FIR filtering, FFTs and custom DSP pipelines.
• Networking & Telecom — Implement protocol engines, packet processing and high-speed I/O subsystems using abundant I/O and Stratix III family SERDES/clock resources.
• Memory Interface Controllers — Leverage the sizable on-chip RAM and family support for DDR/DDR2/DDR3 style interfaces to build memory controllers and caching logic.
• Embedded Compute and Acceleration — Deploy custom compute blocks, hardware accelerators or soft processors where high logic density and on-chip memory reduce external bandwidth needs.

Unique Advantages

• Large, Integrated Logic Fabric: 337,500 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Significant On‑Chip Memory: Approximately 18.8 Mbits of embedded RAM lowers dependence on external memory for buffering and state storage.
• Extensive I/O Capacity: 744 user I/O pins provide flexibility to support parallel interfaces, multiple memory channels or diverse peripheral connections.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in industrial and harsh-environment systems.
• Power/Performance Flexibility: Selectable core voltage range (0.86–1.15 V) enables designers to tune for performance or power efficiency.
• Family-Level System Features: Stratix III family capabilities—clocking resources, PLLs, DSP blocks and configuration security—help accelerate system integration and protect designs.

Why Choose EP3SL340H1152I3G?

The EP3SL340H1152I3G positions itself for designs that need a high-logic-count FPGA with substantial embedded memory and broad I/O. Its industrial temperature rating and surface-mount 1152-ball BGA packaging make it suitable for robust embedded and communications equipment where integration and reliability matter.

As a member of the Stratix III family, the device benefits from family-level clocking, DSP and security features that simplify implementing complex, high-throughput systems while allowing designers to balance power and performance through selectable core voltage options.

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