EP3SL340H1152I3N

The EP3SL340H1152I3N is a Stratix® III L Field Programmable Gate Array (FPGA) IC designed for high-density digital logic integration. It delivers 337,500 logic elements, approximately 18.8 Mbits of on-chip RAM, and up to 744 general-purpose I/Os in a compact 1152-BBGA (40×40) surface-mount package.

Built and specified for industrial environments, this device supports a 0.86–1.15 V core supply range and an operating temperature range of −40 °C to 100 °C, making it suitable for applications that require large logic capacity, significant embedded memory, and extensive I/O in a reliable package.

Key Features

• Core Logic 337,500 logic elements provide high-density programmable logic resources for complex digital designs.
• Embedded Memory Approximately 18.8 Mbits of on-chip RAM to support buffering, state storage, and local data processing without external memory.
• I/O Capacity Up to 744 I/O pins enable broad interfacing options for multi-channel systems, peripheral connectivity, and dense board-level integration.
• Power Supply Core voltage support from 0.86 V to 1.15 V allows designers to match system power rails and manage power budgets.
• Package & Mounting 1152-BBGA (40×40) FCBGA package in a surface-mount form factor for compact board layouts and high pin-count routing.
• Temperature & Grade Industrial-grade specification with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliance Device is RoHS compliant for environmentally conscious design and manufacturing.

Typical Applications

• Industrial Control — High logic density and broad I/O support enable complex control algorithms, multi-axis motor control interfaces, and dense sensor aggregation in industrial systems.
• Communications Infrastructure — Large programmable fabric and substantial on-chip RAM support protocol handling, data buffering, and glue-logic functions for telecom and networking equipment.
• Test & Measurement — Extensive I/O count and embedded memory make the device suitable for instrumentation, data acquisition, and real-time signal processing tasks.
• High-Density Digital Processing — Use for FPGA-based computation, parallel processing tasks, and custom hardware accelerators that require significant logic and memory resources.

Unique Advantages

• High Logic Density: 337,500 logic elements provide the capacity to implement large, complex designs on a single device, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 18.8 Mbits of RAM supports local buffering and state retention, lowering dependence on external memory devices.
• Extensive I/O Count: Up to 744 I/Os allow direct connection to numerous peripherals and interfaces, simplifying system design and reducing the need for multiplexing.
• Industrial Temperature Rating: Specified operation from −40 °C to 100 °C enables deployment in environmentally demanding applications.
• Compact, High-Pin-Count Package: The 1152-BBGA (40×40) surface-mount package balances a high pin count with a compact PCB footprint for dense system integration.
• Flexible Core Voltage: Support for 0.86–1.15 V core supply enables integration with a range of system power architectures.

Why Choose EP3SL340H1152I3N?

The EP3SL340H1152I3N is positioned for designs that demand large programmable logic capacity, significant on-chip memory, and extensive I/O in an industrial-temperature-rated form factor. Its combination of 337,500 logic elements, approximately 18.8 Mbits of RAM, and 744 I/Os provides the integration needed to consolidate functions and reduce bill-of-materials in complex digital systems.

This device is well suited to engineers and procurement teams working on industrial control, communications infrastructure, test equipment, and other applications where high-density FPGA resources, reliable operating temperature range, and a compact high-pin-count package are key selection criteria.

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