EP3SL340H1152I4L

The EP3SL340H1152I4L is an Intel Stratix® III L field programmable gate array (FPGA) IC designed for high-density, industrial-grade digital designs. It combines a large logic fabric—337,500 logic elements—with approximately 18.8 Mbits of embedded memory and 744 I/O pins to support complex logic, buffering and interfacing requirements.

Packaged in a 1152-BBGA (1152-HBGA, 40×40) surface-mount package and rated for industrial operation from −40 °C to 100 °C, this device targets systems that require substantial programmable logic capacity, significant on-chip RAM, and a high I/O count within a compact board footprint.

Key Features

• Core Logic: 337,500 logic elements provide a large programmable fabric for implementing complex digital designs and parallel processing pipelines.
• Embedded Memory: Approximately 18.8 Mbits of on-chip RAM to support data buffering, frame storage, and intermediate computation without external memory.
• I/O Density: 744 general-purpose I/O pins to enable wide bus interfaces, multi-channel data acquisition, and high-pin-count peripheral connectivity.
• Package & Mounting: 1152-BBGA / 1152-HBGA (40×40) surface-mount package suitable for compact, high-density PCB layouts.
• Power Supply Range: Core operating voltage from 860 mV to 1.15 V to match required power rails for the device core.
• Industrial Temperature Range: Rated for −40 °C to 100 °C supporting deployment in industrial environments.
• RoHS Compliant: Meets RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• High-density digital processing: Implement complex signal processing and parallel algorithms using the device’s large logic element count and embedded memory.
• Interface consolidation: Use the extensive I/O count to bridge multiple peripherals and protocol domains on a single programmable device.
• Industrial control systems: Deploy in automation and control equipment that requires industrial temperature operation and significant on-chip resources.
• Prototyping and hardware acceleration: Leverage the large logic capacity and on-chip RAM for accelerated prototyping and custom hardware accelerators.

Unique Advantages

• Large programmable capacity: 337,500 logic elements enable implementation of highly parallel or feature-rich designs without immediate need for multiple devices.
• Substantial on-chip memory: Approximately 18.8 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs, simplifying BOM and board layout.
• High I/O count: 744 I/O pins provide flexibility to connect numerous sensors, peripherals, or high-speed interfaces directly to the FPGA.
• Industrial-grade operation: Rated from −40 °C to 100 °C for stability in demanding environments and extended temperature ranges.
• Compact high-density package: 1152-BBGA (1152-HBGA, 40×40) surface-mount package allows dense implementations in space-constrained systems.
• Regulatory compliance: RoHS compliance supports lead-free manufacturing and aligns with environmental requirements.

Why Choose EP3SL340H1152I4L?

The EP3SL340H1152I4L positions itself as a high-capacity, industrial-grade Stratix® III L FPGA well suited for designs that demand large programmable logic resources, significant embedded memory, and a high count of I/Os within a compact BGA footprint. Its operating voltage range and industrial temperature rating make it appropriate for robust, long-lived systems.

This device is aimed at engineering teams building complex digital systems—such as high-density processing, interface consolidation, and industrial control—who need a single, scalable FPGA solution that reduces board-level complexity while providing ample on-chip resources.

Request a quote today to obtain pricing and lead-time information for EP3SL340H1152I4L and to begin planning procurement for your project.