EP3SL340H1152I4LN

The EP3SL340H1152I4LN is an Intel Stratix® III L FPGA packaged in a 1152-BBGA FCBGA format. It integrates a large programmable fabric with 337,500 logic elements and approximately 18.82 Mbits of embedded memory to support dense digital designs.

This device offers 744 I/O connections, a 0.86 V to 1.15 V core voltage range, and an industrial operating temperature range of −40 °C to 100 °C, delivered in a surface-mount 1152-HBGA (40×40) supplier package.

Key Features

• FPGA Fabric and Logic 337,500 logic elements provide a large programmable resource for implementing complex digital functions.
• On-Chip Memory Approximately 18.82 Mbits of embedded RAM for on-chip buffering, state storage, and memory-intensive logic.
• I/O Capacity 744 I/O pins support extensive external interfacing and parallel connectivity requirements.
• Core Voltage Supports core supply from 0.86 V to 1.15 V to match system power domains and design choices.
• Package and Mounting 1152-BBGA, FCBGA package (supplier device package: 1152-HBGA, 40×40) designed for surface-mount assembly.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in industrial-temperature environments.
• Regulatory Compliance RoHS compliant, meeting common lead-free environmental requirements.

Unique Advantages

• High integration: 337,500 logic elements and ~18.82 Mbits of embedded RAM reduce the need for external logic and memory components.
• Extensive external connectivity: 744 I/O pins enable interfacing with multiple peripherals and parallel buses without additional multiplexing hardware.
• Industrial-ready thermal range: Operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Low-voltage core support: Core voltage range from 0.86 V to 1.15 V facilitates integration into modern low-voltage system architectures.
• Surface-mount BGA packaging: 1152-BBGA / 1152-HBGA (40×40) packaging balances pin density and board-level routing for compact designs.
• RoHS compliant: Meets lead-free manufacturing and environmental compliance needs.

Why Choose EP3SL340H1152I4LN?

The EP3SL340H1152I4LN positions itself as a highly integrated Stratix® III L FPGA option for designs that require a large programmable fabric, substantial on-chip memory, and a high I/O count. Its industrial temperature grade and surface-mount BGA package make it suitable for robust, production-level electronics where board density and thermal range matter.

For engineering teams focused on reducing external component count and consolidating logic and memory on-chip, this FPGA provides measurable integration and interface capacity, backed by Intel's Stratix® III L device family specifications.

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