EP3SL50F484C2G

The EP3SL50F484C2G is a Stratix® III L field-programmable gate array (FPGA) from Intel, offered in a 484‑ball FCBGA package (23 × 23). This device provides 47,500 logic elements, approximately 2.18 Mbits of embedded memory, and 296 general-purpose I/O pins for mid-to-high density programmable logic designs.

Designed for high-performance logic, DSP and embedded applications, the Stratix III family combines selectable core voltage and programmable power technology with a package optimized for signal integrity to enable efficient, scalable system integration in commercial-temperature systems.

Key Features

• Logic Capacity — 47,500 logic elements to implement complex logic, state machines, and control functions.
• Embedded Memory — Approximately 2.18 Mbits of on-chip RAM for FIFOs, buffers and local storage.
• I/O and Packaging — 296 user I/O pins in a 484‑BBGA FCBGA package (484‑FBGA, 23×23) with surface-mount mounting for compact board integration.
• Voltage and Power — Selectable core voltage with an operating supply range of 0.860 V to 1.15 V, enabling trade-offs between power and performance.
• Commercial Temperature Grade — Specified for 0 °C to 85 °C operation for commercial-grade system designs.
• Family-Level Capabilities — Stratix III device family features include programmable power technology, multi-clock architecture, PLL support, optional AES configuration-key security and advanced on-chip memory and DSP resources (family-level information from Stratix III device documentation).
• Standards Compliance — RoHS‑compliant manufacturing status for environmental and regulatory considerations.

Typical Applications

• High‑Performance Logic — Implement complex control and processing pipelines where 47,500 logic elements and embedded memory provide the necessary density and local storage.
• Digital Signal Processing — Deploy DSP functions and custom filtering blocks using the device’s on-chip memory and logic resources for communications or signal-processing subsystems.
• Embedded System Integration — Integrate custom peripherals, bus bridges and control logic in mid-density embedded platforms requiring flexible I/O and programmable functionality.
• High‑Speed Interfaces — Use the modular I/O and package features of the Stratix III family to implement memory interfaces and serial links in networking and communications modules.

Unique Advantages

• Balanced Logic and Memory — 47,500 logic elements combined with ~2.18 Mbits of on-chip RAM provides mix-and-match resources for control, buffering and data-path implementations.
• Flexible I/O in a Compact Package — 296 I/O pins in a 484‑FBGA (23×23) package allow dense board-level integration without sacrificing I/O count.
• Selectable Core Voltage — The 0.860–1.15 V supply range enables designers to balance power consumption and performance per system requirements.
• Commercial-Grade Operation — Specified for 0 °C to 85 °C operation for mainstream commercial deployments.
• Documented Family Ecosystem — Supported by Stratix III family documentation that describes programmable power, clocking, memory and security options useful for system-level design decisions.
• RoHS Compliance — RoHS‑compliant status supports environmental and regulatory objectives for commercial products.

Why Choose EP3SL50F484C2G?

The EP3SL50F484C2G delivers a practical balance of logic density, embedded memory and I/O in a surface-mount 484‑BBGA package, making it well suited to mid- to high-density programmable designs in communications, DSP and embedded systems. Its selectable core voltage and Stratix III family features give designers flexibility to optimize power versus performance for commercial-temperature applications.

This part is targeted at teams that require a documented FPGA platform with ample logic and memory resources, robust I/O count, and a compact package footprint—providing a scalable building block for complex system integration.

Request a quote or submit a product inquiry to receive pricing and availability information for EP3SL50F484C2G.