EP3SL50F484C3

The EP3SL50F484C3 is a Stratix® III L field programmable gate array (FPGA) offered in a 484-ball BGA surface-mount package. It delivers a high-density programmable logic fabric with a large on-chip memory resource and substantial I/O count, targeted for commercial-grade embedded designs.

Designed for applications that require significant programmable logic, embedded RAM and flexible I/O routing in a compact package, this device combines 47,500 logic elements, approximately 2.18 Mbits of embedded memory, and 296 I/O pins while operating from a low-voltage core supply range.

Key Features

• Programmable Logic Capacity  Provides 47,500 logic elements to implement complex custom logic, state machines, and datapath functions.
• Embedded Memory  Approximately 2.18 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for high-throughput designs.
• I/O Resources  296 user I/O pins to support multiple external interfaces, parallel buses or dense peripheral connections.
• Power  Core voltage supply range from 0.860 V to 1.15 V to match system power architectures requiring low-voltage FPGA cores.
• Package & Mounting  484-BBGA (FCBGA) package; supplier device package listed as 484-FBGA (23×23), surface-mount for compact board integration.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial-environment deployments.
• Environmental Compliance  RoHS compliant to meet standard lead-free manufacturing requirements.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic and application-specific processing in commercial devices where a programmable solution is required.
• High-density I/O Designs  Leverage 296 I/O pins to interface with sensors, parallel peripherals, and external memory or communications PHYs.
• Compact Board Integration  Use the 484-FBGA (23×23) surface-mount package to integrate substantial logic and memory into space-constrained PCB layouts.

Unique Advantages

• Large Logic Fabric: 47,500 logic elements enable implementation of substantial custom logic and parallel datapaths without external ASICs.
• Significant On-chip RAM: Approximately 2.18 Mbits of embedded memory reduces dependence on external RAM for many buffering and storage needs.
• Ample I/O Count: 296 I/Os provide design flexibility for complex interfacing and multi-channel connectivity.
• Low-Voltage Core Support: Core supply range from 0.860 V to 1.15 V aligns with modern low-voltage power domains.
• Compact, Surface-Mount Package: 484-BBGA / 484-FBGA (23×23) package supports high-density board layouts while maintaining a surface-mount assembly profile.
• Commercial-grade Qualification: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.

Why Choose EP3SL50F484C3?

The EP3SL50F484C3 positions itself as a commercially graded Stratix® III L FPGA that balances high logic density, substantial embedded memory and a large I/O complement in a compact BGA package. Its combination of 47,500 logic elements, approximately 2.18 Mbits of on-chip RAM and 296 I/Os makes it well suited to commercial embedded designs that require programmable performance and flexible interfacing.

With a low-voltage core supply range and surface-mount 484-BBGA footprint, this device supports integration into modern, space-conscious PCBs while meeting RoHS environmental requirements and commercial temperature constraints.

Request a quote or submit your bidding inquiry today to evaluate the EP3SL50F484C3 for your next commercial FPGA design initiative.