EP3SL50F484C4G

The EP3SL50F484C4G is a Stratix® III L family Field Programmable Gate Array (FPGA) in a 484‑ball FBGA package. It combines a high logic density and embedded memory with family-level capabilities such as selectable core voltage and programmable power management to address high‑performance logic, DSP, and embedded system designs.

Designed for commercial applications, the device delivers 47,500 logic elements, approximately 2.18 Mbits of embedded RAM, and 296 user I/O pins in a surface‑mount 484‑FBGA (23×23) package, supporting integration where performance and flexible I/O are priorities.

Key Features

• Logic Capacity  47,500 logic elements to implement complex logic, control and data‑path functions.
• Embedded Memory  Approximately 2.18 Mbits of on‑chip RAM for FIFOs, buffers and local storage.
• I/O and Packaging  296 user I/O pins in a 484‑BBGA / 484‑FBGA (23×23) surface‑mount package for dense board integration.
• Core Voltage Range  Selectable core voltage operation across 0.86 V to 1.15 V to balance performance and power.
• Temperature and Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Programmable Power and Efficiency  Family features include Programmable Power Technology to reduce power in unused blocks and enable targeted performance.
• High‑Speed System Support  Family supports multi‑clock domains, PLLs, and SERDES/DPA circuitry for high‑speed I/O and timing flexibility.
• Security and Reliability  Family‑level options include 256‑bit AES configuration encryption, CRC for configuration memory error detection, and ECC for embedded memory blocks.
• Regulatory  RoHS compliant.

Typical Applications

• High‑Performance Logic and Control  Implement state machines, protocol bridges and custom control logic where high logic density and flexible I/O are required.
• Digital Signal Processing  Use embedded memory and the Stratix III family’s DSP capabilities for FIR filters, MAC operations and other signal processing tasks.
• Embedded Systems  Integrate custom processors, accelerators and interface logic with on‑chip RAM and multiple clock domains for complex embedded designs.
• High‑Speed Interfaces  Deploy the device in systems requiring high‑speed serial or parallel interfaces leveraging the family’s SERDES and timing features.

Unique Advantages

• High Logic Density: 47,500 logic elements provide headroom for complex designs without immediate migration to larger device families.
• Balanced On‑Chip Memory: Approximately 2.18 Mbits of embedded RAM for local buffering and data‑path storage reduces external memory dependence.
• Flexible I/O in a Compact Package: 296 user I/Os in a 484‑FBGA (23×23) footprint simplifies board layout for dense embedded and communications designs.
• Power Optimization: Selectable core voltage and programmable power features let designers trade performance against power consumption at the block level.
• Configuration Security and Reliability: Family‑level AES encryption options and configuration memory CRC/ECC enhance design protection and runtime reliability.
• Commercial‑Grade Suitability: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronics applications.

Why Choose EP3SL50F484C4G?

EP3SL50F484C4G positions itself as a high‑density, commercially graded Stratix® III L FPGA option for designers who need substantial logic capacity, embedded memory, and flexible I/O in a compact surface‑mount FBGA package. The device benefits from Stratix III family innovations such as selectable core voltage and programmable power, enabling design tradeoffs between performance and power consumption.

This part is well suited to teams building high‑performance logic, DSP and embedded systems that require configurable security and on‑chip reliability features, and who value a scalable FPGA family ecosystem for future design growth.

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