EP3SL50F484C4

The EP3SL50F484C4 is a Stratix® III L Field Programmable Gate Array (FPGA) in a 484‑ball BGA package offering high logic density and extensive I/O. With 47,500 logic elements and approximately 2.18 Mbits of on‑chip RAM, this commercial‑grade FPGA provides a compact, high‑capacity programmable fabric for designs that require substantial combinational and sequential logic plus embedded memory.

Packaged as a 484‑BBGA (23×23) surface‑mount device and rated for a supply range of 860 mV to 1.15 V and an operating temperature of 0 °C to 85 °C, the EP3SL50F484C4 is targeted at applications needing dense logic integration and high I/O count within a standard commercial temperature range.

Key Features

• Core Logic  47,500 logic elements provide a large programmable fabric for complex digital functions and custom hardware implementation.
• Embedded Memory  Approximately 2.18 Mbits of on‑chip RAM to support buffering, state storage, and memory‑intensive logic blocks.
• I/O Density  296 I/O pins to accommodate broad interfacing requirements and high channel counts for system integration.
• Power  Operates from a core supply range of 860 mV to 1.15 V to match system power domains and device requirements.
• Package and Mounting  484‑ball BGA (484‑BBGA / 484‑FBGA, 23×23) in a surface‑mount format for compact board integration and reliable connections.
• Operating Range  Commercial temperature rating from 0 °C to 85 °C and RoHS compliance for standard commercial deployments.

Typical Applications

• Custom digital logic and prototyping  Use the EP3SL50F484C4 to implement complex, application‑specific logic and accelerate development cycles with reprogrammable hardware.
• High‑density I/O control  Leverage 296 I/O pins for multi‑channel interfaces, peripheral aggregation, and system glue logic.
• On‑chip buffering and data path memory  Embedded RAM supports intermediate buffering, FIFOs, and state machines within data‑flow architectures.

Unique Advantages

• High logic capacity: 47,500 logic elements provide the headroom to consolidate multiple functions into a single device and reduce system complexity.
• Significant embedded memory: Approximately 2.18 Mbits of on‑chip RAM enables local data storage and reduces external memory dependency.
• Extensive I/O: 296 I/O pins simplify board routing for complex systems and support diverse peripheral connections.
• Compact BGA packaging: 484‑ball BGA (23×23) delivers a dense package footprint for space‑constrained boards while maintaining robust soldered connections.
• Commercial readiness and compliance: Commercial temperature rating and RoHS compliance support standard industrial and consumer product lifecycles.
• Flexible power domain integration: Core supply range from 860 mV to 1.15 V allows adaptation to common FPGA power architectures.

Why Choose EP3SL50F484C4?

The EP3SL50F484C4 positions itself as a high‑capacity Stratix® III L FPGA option for designs that require substantial programmable logic, embedded memory, and a high number of I/O in a compact surface‑mount BGA package. Its combination of 47,500 logic elements, approximately 2.18 Mbits of on‑chip RAM, and 296 I/O makes it well suited to consolidate multiple digital functions and reduce board-level complexity within commercial temperature environments.

For engineering teams and procurement looking to balance integration density, I/O richness, and standard commercial reliability, the EP3SL50F484C4 delivers a focused set of capabilities that support scalable designs and streamlined BOMs.

Request a quote or submit your procurement inquiry to get pricing and availability for the EP3SL50F484C4. Our team will respond with a tailored quote and lead‑time information.