EP3SL50F484C4L

The EP3SL50F484C4L is a Stratix® III L field programmable gate array (FPGA) in a 484-ball FCBGA package designed for commercial electronic designs. It provides a high logic element count, substantial on-chip RAM, and a large I/O complement for designs that require dense programmable logic and broad external interfacing.

This device is well suited to applications that demand integrated logic capacity and flexible I/O within a compact surface-mount 23×23 484-FBGA footprint, while operating within a commercial temperature range.

Key Features

• Logic Capacity – 47,500 logic elements provide substantial programmable logic resources for complex combinational and sequential functions.
• Embedded Memory – Approximately 2.18 Mbits of on-chip RAM to support buffering, LUTs, and local data storage without external memory.
• I/O Density – 296 user I/O pins enable extensive interfacing to peripherals, sensors, and external devices.
• Power – Core operating voltage range from 0.86 V to 1.15 V for compatibility with system power rails and optimized core power consumption.
• Package & Mounting – 484-BBGA (484-FBGA, 23×23) surface-mount package for compact board-level integration.
• Operating Range & Grade – Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance – RoHS compliant to meet standard lead-free manufacturing requirements.

Typical Applications

• High-density programmable logic – Use the device where 47,500 logic elements are needed to implement complex state machines, datapaths, or custom accelerators.
• Memory-buffered systems – On-chip ~2.18 Mbits of RAM supports local buffering and temporary storage for data processing tasks.
• High I/O interfacing – 296 I/O pins enable broad connectivity for multi-channel digital interfaces and peripheral aggregation.

Unique Advantages

• High integration in a compact package: 47,500 logic elements and substantial embedded memory in a 23×23 484-FBGA minimize board area while preserving capability.
• Broad external interfacing: 296 user I/O pins reduce the need for additional interface devices and simplify routing for complex systems.
• On-chip RAM for reduced BOM: Approximately 2.18 Mbits of embedded memory lowers dependence on external memory components for many buffering and storage needs.
• Commercial temperature suitability: Rated 0 °C to 85 °C for a wide range of standard electronic products and development platforms.
• RoHS compliance: Facilitates integration into lead-free manufacturing flows and standard environmental compliance processes.

Why Choose EP3SL50F484C4L?

The EP3SL50F484C4L positions itself as a capable platform for projects that require dense programmable logic, meaningful on-chip memory, and extensive I/O in a compact surface-mount FCBGA package. Its combination of 47,500 logic elements, approximately 2.18 Mbits of embedded RAM, and 296 I/O makes it suitable for complex digital designs where board space and integration matter.

Engineers and procurement teams looking for a commercial-grade FPGA with clear, verifiable specifications will find this device offers a balance of logic density, memory resources, and package-level integration to support scalable designs and streamlined BOMs.

Request a quote or submit a sales inquiry for EP3SL50F484C4L to receive pricing, availability, and ordering information tailored to your project needs.