EP3SL50F484I3

The EP3SL50F484I3 is a Stratix® III L family FPGA provided in a 484-BBGA FCBGA package. It delivers a substantial logic capacity with 47,500 logic elements and approximately 2.18 Mbits of embedded RAM, enabling integration of complex digital functions on a single device.

Designed for industrial-grade applications, this surface-mount FPGA offers 296 user I/O pins, a wide supply voltage window (860 mV to 1.15 V), and an operating temperature range of −40 °C to 100 °C to meet demanding environmental requirements.

Key Features

• Core Logic 47,500 logic elements for implementing large-scale digital designs and complex combinational/sequential logic.
• Embedded Memory Approximately 2.18 Mbits of on-chip RAM to support data buffering, state machines, and local storage without external memory.
• I/O Resources 296 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
• Package & Mounting 484-BBGA FCBGA (484-FBGA, 23×23) package optimized for surface-mount PCB assembly and dense board integration.
• Power Core supply voltage range from 860 mV to 1.15 V to match system power-rail requirements and support efficient power distribution.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C for reliable performance in temperature-variable environments.

Unique Advantages

• High integration density: 47,500 logic elements reduce the need for multiple discrete components, simplifying system architecture and saving board space.
• On-chip memory capacity: Approximately 2.18 Mbits of embedded RAM enables local buffering and fast access to working data without immediate reliance on external memory.
• Extensive I/O flexibility: 296 I/O pins allow broad connectivity options for interfacing with a wide range of digital peripherals and signals.
• Industrial operating range: Specified −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
• Compact surface-mount package: 484-BBGA (23×23) package supports high-density PCB layouts and modern assembly processes.
• Tight core-voltage specification: 860 mV to 1.15 V supply range facilitates integration with targeted power-delivery designs.

Why Choose EP3SL50F484I3?

The EP3SL50F484I3 combines substantial logic capacity, significant on-chip memory, and a high I/O count in an industrial-grade, surface-mount 484-BBGA package. Its electrical and thermal specifications make it appropriate for designs that require robust, integrated digital resources within a defined supply-voltage envelope and extended temperature range.

This device is well suited for engineering teams seeking a high-density FPGA platform that consolidates logic and memory resources on-chip while maintaining the board-level flexibility afforded by numerous I/O and a standardized FCBGA package.

Request a quote or submit an inquiry to obtain pricing and availability for EP3SL50F484I3. Our team can provide lead-time details and support for procurement and integration planning.