EP3SL50F484I3G

The EP3SL50F484I3G is a Stratix III L series field programmable gate array (FPGA) in a 484‑ball FCBGA package, optimized for balanced logic, memory, and multiplier resources. Targeted at industrial applications, it combines approximately 47,500 logic elements with embedded memory and a flexible I/O complement to support mid‑to‑high complexity digital, signal processing, and interface integration tasks.

Built on the Stratix III architecture, this device delivers selectable core voltage operation and on‑chip system features that help designers manage performance and power within an industrial operating range.

Key Features

• Logic Capacity — Approximately 47,500 logic elements to implement medium‑complexity FPGA designs and custom logic functions.
• Embedded Memory — Approximately 2.08 Mbits of on‑chip RAM (2,184,192 bits) for data buffering, FIFOs, and state storage.
• I/O Resources — 296 user I/O pins in a modular bank structure to support diverse interface standards and board connectivity.
• Core Voltage — Voltage supply range 0.860 V to 1.15 V enabling selectable core operation modes for power/performance tradeoffs.
• Package & Mounting — 484‑BBGA (FCBGA) package, supplier device package 484‑FBGA (23×23), surface mount for compact system integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for use in industrial environments.
• Security & Reliability (Stratix III family) — Optional 256‑bit AES volatile and non‑volatile configuration bitstream encryption, CRC for configuration memory error detection, and built‑in ECC for TriMatrix memory blocks.
• Clocking & Timing (Stratix III family) — Family features include up to 16 global clocks, 88 regional clocks, 116 peripheral clocks, and up to 12 PLLs for flexible clock management and synthesis.
• DSP & High‑Speed I/O (Stratix III family) — High‑speed DSP block support for a range of multipliers (9×9, 12×12, 18×18, 36×36) and SERDES/DPA circuitry for high‑speed differential links.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement machine control logic, real‑time sequencing, and I/O aggregation while operating across industrial temperature ranges.
• Communications & Networking — Use embedded DSP resources and high‑speed I/O capabilities for protocol handling, packet processing, and interface bridging.
• Data Acquisition & Signal Processing — Leverage on‑chip RAM and DSP blocks for buffering, filtering, and real‑time data manipulation in measurement systems.
• Embedded System Integration — Combine logic, memory, and I/O on a single device to reduce board count in mid‑density FPGA designs and custom controllers.

Unique Advantages

• Balanced resource mix — The combination of ~47,500 logic elements and ~2.08 Mbits of embedded memory supports a wide range of mid‑complexity designs without overprovisioning.
• Selectable core voltage — Core supply range (0.860–1.15 V) lets designers tune power versus performance to meet system requirements.
• Industrial operating range — −40 °C to 100 °C rating provides headroom for deployments in typical industrial environments.
• Package density for compact designs — 484‑ball FCBGA packaging enables high interconnect density in space‑constrained boards.
• Security and reliability features — Family‑level AES encryption, CRC, and ECC options help protect configuration data and maintain system availability.
• Flexible clocking and DSP support — Multiple global/regional clocks, PLLs, and DSP multipliers support complex timing and signal processing requirements.

Why Choose EP3SL50F484I3G?

The EP3SL50F484I3G positions itself as a versatile, industrial‑grade Stratix III L FPGA option for designs that require a balanced mix of logic, embedded memory, and I/O in a compact FCBGA package. Its selectable core voltage and Stratix III family features for clock management, DSP, security, and memory reliability make it suitable for engineering teams building mid‑density, performance‑sensitive systems that must meet industrial environmental demands.

Choosing this device provides access to the Stratix III architecture capabilities while keeping board-level integration simple through a single, high‑density package and standard surface‑mount mounting.

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