EP3SL50F484I4

The EP3SL50F484I4 is a Stratix® III L field programmable gate array (FPGA) from Intel, offering a high-density programmable fabric with 47,500 logic elements and substantial on-chip memory. Built for surface-mount deployment in a 484-BBGA (FCBGA) package, this device targets industrial-grade applications that require large logic capacity, abundant I/O, and embedded memory resources.

Key platform attributes include approximately 2.18 Mbits of embedded memory, up to 296 I/O pins, and a core supply range from 860 mV to 1.15 V, enabling integration into systems that demand robust logic integration and wide operating temperature capability.

Key Features

• Logic Capacity — 47,500 logic elements provide significant programmable logic density for complex digital designs.
• Logic Blocks — 1,900 logic blocks provide a structured resource count to plan partitioning and implementation.
• Embedded Memory — Approximately 2.18 Mbits of on-chip RAM to support data buffering, FIFOs, and embedded storage needs.
• I/O — 296 user I/O pins enabling broad external connectivity and interface options in system designs.
• Power — Core voltage supply range of 860 mV to 1.15 V to match platform power-rail requirements.
• Package & Mounting — 484-BBGA (FCBGA) package, supplier device package 484-FBGA (23×23), designed for surface-mount assembly.
• Temperature Range — Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance — RoHS compliant, supporting lead-free manufacturing and environmental compliance goals.

Typical Applications

• Industrial Control Systems — Use the device’s industrial temperature rating and high logic density for control logic, sequencing, and real-time processing in factory automation and motor-control subsystems.
• High-Density Logic Integration — Implement large custom logic functions and glue-logic for complex boards where 47,500 logic elements and extensive I/O simplify system partitioning.
• Embedded Memory-Intensive Functions — Leverage approximately 2.18 Mbits of on-chip RAM for buffering, packet buffering, and intermediate data storage without immediate external memory dependence.

Unique Advantages

• Substantial Programmable Capacity: 47,500 logic elements enable consolidation of multiple digital functions into a single device, reducing board-level component count.
• Balanced I/O and Memory Resources: 296 I/O pins combined with ~2.18 Mbits of embedded RAM support designs that need both connectivity and local storage.
• Industrial Temperature Range: Rated from −40 °C to 100 °C, the device supports deployment in demanding ambient conditions common in industrial applications.
• Flexible Packaging: The 484-BBGA (23×23) FCBGA package offers a compact surface-mount form factor suitable for high-density PCB layouts.
• RoHS Compliant: Meets environmental and manufacturing requirements for lead-free assembly processes.

Why Choose EP3SL50F484I4?

The EP3SL50F484I4 positions itself as a high-capacity, industrial-grade FPGA option for designs that require a large number of logic elements, ample on-chip memory, and substantial I/O in a compact BGA package. Its combination of 47,500 logic elements, approximately 2.18 Mbits of embedded RAM, and a 296-pin I/O count makes it suitable for systems that consolidate complex digital processing and interface functions onto a single programmable device.

Designed for durability and integration, the device’s surface-mount 484-BBGA package and −40 °C to 100 °C operating range provide long-term value for projects needing scalable programmable logic, robust environmental tolerance, and RoHS-compliant manufacturing.

If you would like a quote or additional procurement information for EP3SL50F484I4, submit a request for quote or contact our sales team to discuss availability and pricing.