EP3SL50F484I4LN

The EP3SL50F484I4LN is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel designed for industrial applications. It integrates 47,500 logic elements and approximately 2.18 Mbits of embedded memory in a 484‑ball FCBGA package while supporting up to 296 I/O signals.

With a supply voltage range of 0.86 V to 1.15 V and an operating temperature range of −40 °C to 100 °C, this surface‑mount device targets designs that require high logic density, significant on‑chip memory, and industrial temperature capability.

Key Features

• Logic Capacity  Provides 47,500 logic elements to implement complex digital designs and custom logic functions.
• Embedded Memory  Approximately 2.18 Mbits of on‑chip RAM for buffering, lookup tables, and state storage.
• I/O Density  Up to 296 I/O pins to support broad peripheral interfacing and high‑pin‑count systems.
• Power  Operates over a core supply range of 0.86 V to 1.15 V to match system power budgets and interfaces.
• Package and Mounting  484‑BBGA FCBGA surface‑mount package (supplier device package: 484‑FBGA, 23×23) for high‑density board integration.
• Temperature and Grade  Industrial grade device rated for operation from −40 °C to 100 °C for harsh environments.
• Environmental Compliance  RoHS compliant to align with environmental and regulatory requirements.

Typical Applications

• Industrial Control Systems  Use the FPGA’s industrial temperature rating and high I/O count for motor control, PLC interfaces, and factory automation designs.
• High‑Density I/O Applications  Leverage up to 296 I/O pins for multi‑channel data acquisition, protocol bridging, and communication front ends.
• Embedded Signal Processing  Deploy the combination of 47,500 logic elements and on‑chip RAM for real‑time processing, buffering, and custom accelerators.

Unique Advantages

• High Logic Integration: 47,500 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
• Significant On‑Chip Memory: Approximately 2.18 Mbits of embedded RAM supports data buffering and stateful processing without external memory.
• Robust Industrial Operation: Rated from −40 °C to 100 °C and specified as industrial grade to support deployment in demanding environments.
• Compact, High‑Density Package: 484‑BBGA (23×23) FCBGA surface‑mount package minimizes board area while supporting high I/O counts.
• Power Flexibility: Core supply range of 0.86 V to 1.15 V aligns with modern power architectures for efficient system integration.
• Regulatory Alignment: RoHS compliance helps meet environmental and manufacturing standards.

Why Choose EP3SL50F484I4LN?

The EP3SL50F484I4LN delivers a balanced combination of logic density, embedded memory, and I/O capacity in a compact industrial‑grade FCBGA package. It is positioned for designers who need to integrate substantial custom logic and memory on a single device while meeting industrial temperature and environmental requirements.

This FPGA is well suited for projects that demand scalability, on‑chip resources, and reliable operation in harsh conditions, offering a clear path to reduce external components and simplify board design.

Request a quote or submit a part inquiry to receive pricing, availability, and support information for the EP3SL50F484I4LN.