EP3SL50F780C2G

The EP3SL50F780C2G is an Intel Stratix® III L field-programmable gate array in a 780-BBGA (780-FBGA, 29×29) surface-mount package. It delivers a balanced combination of logic, embedded memory and DSP-oriented architecture suitable for high-performance logic, digital signal processing and embedded system designs.

With approximately 47,500 logic elements, roughly 2.18 Mbits of on-chip RAM (2,184,192 bits), and 488 user I/O pins, this commercial-grade, RoHS-compliant device supports flexible power/performance tradeoffs via a core voltage range of 860 mV to 1.15 V and is rated for 0 °C to 85 °C operation.

Key Features

• Logic capacity — Approximately 47,500 logic elements provide the fabric for complex control, datapath and packet-processing implementations.
• Embedded memory — Approximately 2.18 Mbits of on-chip RAM supports FIFOs, buffers and localized data storage to reduce external memory dependency.
• I/O and package — 488 user I/Os in a 780-BBGA surface-mount package (780-FBGA, 29×29) enable dense board integration and broad signal interfacing.
• Core voltage and power configurability — Operates across a core voltage range of 860 mV to 1.15 V, enabling designers to tune for lower power or higher performance.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C and supplied as a RoHS-compliant component for commercial applications.
• Stratix III family architecture — Series-level capabilities include dedicated DSP multiplier blocks, up to 12 PLLs, extensive clocking resources, modular I/O banks and on-chip termination for improved signal integrity.
• Security and reliability (series features) — Series support for 256-bit AES configuration encryption, CRC for configuration memory integrity, and ECC for embedded memory help protect designs and detect/correct errors.

Typical Applications

• High-performance DSP and compute — Implement filtering, signal conditioning and custom arithmetic datapaths using the device's logic elements and DSP resources.
• Networking and communications — Leverage high-density I/O and series-level SERDES/DPA support for protocol processing and interface bridging.
• Memory interface controllers — Modular I/O banks and dedicated DQS logic from the Stratix III family enable robust DDR/DDR2/DDR3 and other external memory interfaces.
• Embedded systems and control — Integrate soft-core processors (Nios® II support at the series level) and peripheral logic for flexible system control and orchestration.

Unique Advantages

• High integration density: 47,500 logic elements combined with ~2.18 Mbits of embedded memory reduce the need for external components and simplify board-level design.
• Power/performance flexibility: Core voltage scaling from 860 mV to 1.15 V lets designers optimize for energy efficiency or peak throughput as needed.
• Broad I/O connectivity in a compact package: 488 user I/Os in a 780-FBGA (29×29) form factor support dense signal routing and modular I/O bank architectures.
• Series-level reliability features: CRC and ECC capabilities help detect and correct configuration and memory errors for improved system availability.
• Design security options: Support for 256-bit AES configuration encryption protects IP and bitstream confidentiality.

Why Choose EP3SL50F780C2G?

The EP3SL50F780C2G positions the Stratix III L architecture into a compact, commercial-grade 780-FBGA package, delivering a strong balance of logic capacity, embedded memory and I/O density for demanding FPGA-based designs. Its selectable core voltage and family-level power-management features give designers practical options to tune power versus performance.

This device is suited to customers building high-performance logic, DSP, networking and embedded systems that need on-chip memory, abundant I/O and series-provided features such as AES configuration encryption, ECC and extensive clocking/PLLs. The Stratix III family handbook and megafunction support provide a foundation for scalable designs and integration with soft-core processors and standard IP.

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