EP3SL50F780C3N

IC FPGA 488 I/O 780FBGA
Part Description

Stratix® III L Field Programmable Gate Array (FPGA) IC 488 2184192 47500 780-BBGA, FCBGA

Quantity 471 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1900Number of Logic Elements/Cells47500
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2184192

Overview of EP3SL50F780C3N – Stratix® III L Field Programmable Gate Array (FPGA) IC 488 2184192 47500 780-BBGA, FCBGA

The EP3SL50F780C3N is a Stratix® III L field programmable gate array (FPGA) offered in a 780-FBGA (29×29) surface-mount package. It provides 47,500 logic elements, approximately 2.18 Mbits of embedded memory, and 488 user I/O pins, making it suitable for complex logic integration and on-chip memory tasks.

Designed for commercial-grade systems, this device operates from a core supply range of 0.86 V to 1.15 V and across an ambient temperature range of 0 °C to 85 °C. The device family documentation highlights architecture elements such as embedded memory blocks, DSP blocks, clock networks and PLLs, and high-speed I/O capabilities.

Key Features

  • Logic Capacity  Provides 47,500 logic elements for implementing complex digital designs and system functions on a single device.
  • Embedded Memory  Approximately 2.18 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
  • I/O Resources  488 user I/O pins in a 780-FBGA (29×29) package to support broad interfacing and board-level connectivity.
  • Package & Mounting  780-BBGA / FCBGA supplier package (780-FBGA, 29×29) supplied as a surface-mount device to fit compact PCB layouts.
  • Power  Core voltage supply range from 0.86 V to 1.15 V to match system power-rail designs.
  • Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Architecture Highlights (series-level)  Series documentation references TriMatrix embedded memory blocks, DSP blocks, multi-track interconnect, clock networks and PLLs, and high-speed differential I/O with configurable alignment features.
  • Standards & Compliance  RoHS compliant for global electronics manufacturing requirements.

Typical Applications

  • High-performance signal processing  Use the device’s large logic capacity and documented DSP block support for compute-intensive digital signal processing tasks.
  • Packet processing and networking  Abundant logic elements, on-chip memory and extensive I/O enable protocol handling and packet buffering for networking functions.
  • Custom hardware acceleration  Implement custom accelerators and data-paths leveraging the device’s logic density and embedded RAM.
  • System integration & glue logic  Large I/O count and flexible packaging allow consolidation of multiple board-level functions into a single FPGA.

Unique Advantages

  • High logic density: 47,500 logic elements provide the capacity to implement sizable, integrated digital systems on one device, reducing board-level complexity.
  • Significant on-chip memory: Approximately 2.18 Mbits of embedded RAM supports local buffering and state storage without requiring external memory for many use cases.
  • Extensive I/O resources: 488 user I/O pins in a compact 780-FBGA package enable broad interfacing while conserving PCB area.
  • Commercial temperature rating: Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronic products and environments.
  • Configurable power envelope: Core supply range of 0.86 V–1.15 V allows integration into designs with modern low-voltage power rails.
  • Regulatory-friendly production: RoHS compliance supports environmentally conscious manufacturing and downstream supply chain requirements.

Why Choose EP3SL50F780C3N?

The EP3SL50F780C3N positions itself as a high-capacity Stratix® III L FPGA option for commercial designs that require substantial logic resources, embedded memory, and a large number of I/O in a compact BGA package. Its documented architecture elements—embedded memory blocks, DSP capabilities, programmable clocking and high-speed I/O—make it appropriate for designs demanding on-chip integration of processing, buffering, and interfacing.

This device suits engineering teams building complex digital systems who need a scalable, well-documented FPGA with measurable on-chip resources and a commercial temperature rating. The combination of logic capacity, embedded RAM, and package density delivers a path to reduce component count and simplify board-level design while meeting RoHS manufacturing requirements.

If you would like pricing, availability, or a formal quote for the EP3SL50F780C3N, submit a request and our sales team will respond with the details you need.

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