EP3SL50F780C3N
| Part Description |
Stratix® III L Field Programmable Gate Array (FPGA) IC 488 2184192 47500 780-BBGA, FCBGA |
|---|---|
| Quantity | 471 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1900 | Number of Logic Elements/Cells | 47500 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2184192 |
Overview of EP3SL50F780C3N – Stratix® III L Field Programmable Gate Array (FPGA) IC 488 2184192 47500 780-BBGA, FCBGA
The EP3SL50F780C3N is a Stratix® III L field programmable gate array (FPGA) offered in a 780-FBGA (29×29) surface-mount package. It provides 47,500 logic elements, approximately 2.18 Mbits of embedded memory, and 488 user I/O pins, making it suitable for complex logic integration and on-chip memory tasks.
Designed for commercial-grade systems, this device operates from a core supply range of 0.86 V to 1.15 V and across an ambient temperature range of 0 °C to 85 °C. The device family documentation highlights architecture elements such as embedded memory blocks, DSP blocks, clock networks and PLLs, and high-speed I/O capabilities.
Key Features
- Logic Capacity Provides 47,500 logic elements for implementing complex digital designs and system functions on a single device.
- Embedded Memory Approximately 2.18 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
- I/O Resources 488 user I/O pins in a 780-FBGA (29×29) package to support broad interfacing and board-level connectivity.
- Package & Mounting 780-BBGA / FCBGA supplier package (780-FBGA, 29×29) supplied as a surface-mount device to fit compact PCB layouts.
- Power Core voltage supply range from 0.86 V to 1.15 V to match system power-rail designs.
- Operating Range Commercial temperature grade with an operating range of 0 °C to 85 °C.
- Architecture Highlights (series-level) Series documentation references TriMatrix embedded memory blocks, DSP blocks, multi-track interconnect, clock networks and PLLs, and high-speed differential I/O with configurable alignment features.
- Standards & Compliance RoHS compliant for global electronics manufacturing requirements.
Typical Applications
- High-performance signal processing Use the device’s large logic capacity and documented DSP block support for compute-intensive digital signal processing tasks.
- Packet processing and networking Abundant logic elements, on-chip memory and extensive I/O enable protocol handling and packet buffering for networking functions.
- Custom hardware acceleration Implement custom accelerators and data-paths leveraging the device’s logic density and embedded RAM.
- System integration & glue logic Large I/O count and flexible packaging allow consolidation of multiple board-level functions into a single FPGA.
Unique Advantages
- High logic density: 47,500 logic elements provide the capacity to implement sizable, integrated digital systems on one device, reducing board-level complexity.
- Significant on-chip memory: Approximately 2.18 Mbits of embedded RAM supports local buffering and state storage without requiring external memory for many use cases.
- Extensive I/O resources: 488 user I/O pins in a compact 780-FBGA package enable broad interfacing while conserving PCB area.
- Commercial temperature rating: Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronic products and environments.
- Configurable power envelope: Core supply range of 0.86 V–1.15 V allows integration into designs with modern low-voltage power rails.
- Regulatory-friendly production: RoHS compliance supports environmentally conscious manufacturing and downstream supply chain requirements.
Why Choose EP3SL50F780C3N?
The EP3SL50F780C3N positions itself as a high-capacity Stratix® III L FPGA option for commercial designs that require substantial logic resources, embedded memory, and a large number of I/O in a compact BGA package. Its documented architecture elements—embedded memory blocks, DSP capabilities, programmable clocking and high-speed I/O—make it appropriate for designs demanding on-chip integration of processing, buffering, and interfacing.
This device suits engineering teams building complex digital systems who need a scalable, well-documented FPGA with measurable on-chip resources and a commercial temperature rating. The combination of logic capacity, embedded RAM, and package density delivers a path to reduce component count and simplify board-level design while meeting RoHS manufacturing requirements.
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