EP3SL50F780C4LG

IC FPGA 488 I/O 780FBGA
Part Description

Stratix® III L Field Programmable Gate Array (FPGA) IC 488 2184192 47500 780-BBGA, FCBGA

Quantity 215 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1900Number of Logic Elements/Cells47500
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits2184192

Overview of EP3SL50F780C4LG – Stratix® III L Field Programmable Gate Array (FPGA) IC, 47,500 logic elements, 780-FBGA

The EP3SL50F780C4LG is a Stratix® III L family FPGA offering a balance of logic, embedded memory, and high‑speed I/O for high-performance digital designs. Built on the Stratix III architecture, it targets applications that require substantial programmable logic, on‑chip RAM, and flexible I/O in a 780‑ball FCBGA package.

This commercial‑grade, RoHS‑compliant device provides 47,500 logic elements, approximately 2.18 Mbits of embedded memory, and 488 user I/Os, with selectable core voltage and Programmable Power Technology for power/performance tradeoffs.

Key Features

  • Programmable Logic — 47,500 logic elements (LEs) for implementing complex digital logic and control functions.
  • On‑chip Memory — Approximately 2.18 Mbits of embedded RAM to support FIFOs, buffers, and memory‑centric functions.
  • High‑Density I/O — 488 user I/Os arranged for modular banking and flexible interface support.
  • Package & Mounting — 780‑FBGA (29×29) FCBGA package, surface‑mount for high‑density board designs.
  • Core Voltage Range — Selectable core voltage operation from 0.86 V to 1.15 V to tune power and performance.
  • Operating Range — Commercial operating temperature from 0 °C to 85 °C.
  • Power Management — Programmable Power Technology (family feature) enables dynamic power/performance optimization by powering blocks only when needed.
  • Clocking & Timing — Family support for multiple clock resources including up to 16 global clocks and up to 12 PLLs for clock synthesis and phase control.
  • High‑Speed I/O Capabilities — Family‑level support for SERDES and dynamic phase alignment circuitry for high‑speed serial interfaces.
  • Security & Reliability — Family options include AES configuration bitstream security and on‑chip error detection/correction features for enhanced reliability.
  • Regulatory — RoHS compliant.

Typical Applications

  • High‑Performance Logic & Control — Implement complex control engines, state machines, and custom logic for communications or industrial equipment using abundant logic elements.
  • Digital Signal Processing — Deploy DSP functions and data‑path processing with integrated on‑chip RAM and dense logic resources.
  • Memory Interface & Buffering — Use embedded RAM and modular I/O banks for memory controllers, buffering, and interface bridging.
  • Networking & Communications — Implement packet processing, protocol logic, and serial interfaces leveraging high‑speed I/O and clocking resources.

Unique Advantages

  • High Logic Capacity: 47,500 logic elements permit implementation of substantial custom logic without external ASICs.
  • Significant Embedded Memory: Approximately 2.18 Mbits of on‑chip RAM reduces external memory reliance for many buffering and storage tasks.
  • Flexible Power/Performance: Selectable core voltage and Programmable Power Technology allow designers to tune the device for power or performance as required.
  • Dense I/O in a Compact Package: 488 user I/Os in a 780‑FBGA (29×29) package help minimize PCB area while supporting a variety of interfaces.
  • Commercial‑Grade Reliability: Designed for 0 °C to 85 °C operation and RoHS compliance for mainstream electronics applications.
  • Ecosystem & Integration: Family support includes embedded processor and megafunction options to accelerate system integration and IP reuse.

Why Choose EP3SL50F780C4LG?

The EP3SL50F780C4LG positions itself as a balanced, high‑capacity FPGA for designers who need substantial logic, embedded memory, and flexible I/O in a commercial‑grade device. Its selectable core voltage and family Programmable Power Technology enable tradeoffs between power consumption and performance to match target system requirements.

This Stratix III L device is suited to teams developing high‑performance digital, DSP, and communications designs that benefit from on‑chip RAM, extensive I/O, and advanced clocking and SERDES capabilities, with the option to leverage family‑level security and reliability features.

Request a quote or submit an inquiry to get pricing and availability for EP3SL50F780C4LG and to discuss how this Stratix® III L FPGA can fit your next design.

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