EP3SL50F780C4N

The EP3SL50F780C4N is a Stratix® III L Field Programmable Gate Array (FPGA) IC manufactured by Intel. This surface-mount FCBGA device delivers a large allocation of programmable logic, on-chip memory, and I/O resources for demanding commercial designs.

Specified with 47,500 logic elements and approximately 2.18 Mbits of embedded memory, the device is intended for designs that require high logic density, significant local RAM, and a broad I/O count within a 780‑ball FBGA (29 × 29) package. Operating conditions and detailed electrical characteristics are documented in the Stratix III device handbook.

Key Features

• Logic Capacity  Provides 47,500 logic elements (cells) enabling complex, high-density digital designs.
• Embedded Memory  Approximately 2.18 Mbits of on-chip RAM for local buffering, FIFOs, and small-memory functions.
• I/O Resources  488 user I/Os to support wide parallel interfaces and numerous peripheral connections.
• Package & Mounting  780-BBGA / FCBGA package (supplier device package: 780-FBGA, 29×29) optimized for surface-mount assembly.
• Power Supply  Core supply operating range from 860 mV to 1.15 V to match system power rails and core-voltage requirements.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance & Documentation  RoHS‑compliant; comprehensive technical documentation available in the Stratix III device handbook covering DC and switching characteristics, PLL specifications, DSP block specifications, TriMatrix memory block specifications, and configuration/JTAG details.

Unique Advantages

• High logic density: 47,500 logic elements provide the capacity to implement complex custom logic and multi-function subsystems on a single FPGA.
• Significant on-chip RAM: Approximately 2.18 Mbits of embedded memory reduces external-memory dependence for mid-sized buffering and local data storage.
• Extensive I/O count: 488 I/Os enable broad peripheral connectivity and parallel interface options without additional I/O expanders.
• Compact FCBGA package: 780-BBGA (29 × 29) balances pin count and board-area efficiency for surface-mount applications.
• Documented electrical and performance data: Device handbook coverage of DC/switching characteristics, PLLs, DSP blocks, memory blocks, and configuration/JTAG supports rigorous design and validation.
• RoHS compliance: Meets environmental requirements for lead-free assembly processes.

Why Choose EP3SL50F780C4N?

The EP3SL50F780C4N positions itself as a high-capacity Stratix III L FPGA option for commercial designs requiring substantial programmable logic, embedded memory, and a large I/O footprint in a compact FCBGA package. Its documented electrical characteristics and block-level specifications in the Stratix III device handbook help streamline design verification and system integration.

This device is suited to engineers and procurement teams seeking a RoHS-compliant, surface-mount FPGA with defined operating voltage and temperature ranges, substantial logic resources, and broad I/O availability for mid- to high-density digital designs.

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