EP3SL50F780I3N

The EP3SL50F780I3N is a Stratix® III L Field Programmable Gate Array (FPGA) IC offering 47,500 logic elements and substantial on-chip memory for mid-to-high density programmable logic designs. It targets applications that require a combination of large logic capacity, significant embedded RAM, extensive I/O, and industrial temperature operation.

With an operating range of −40 °C to 100 °C and a low-voltage core supply range, this device is positioned for designs where reliable operation across a wide temperature span and compact surface-mount packaging are important.

Key Features

• Logic Capacity — 47,500 logic elements provide a high level of programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 2.18 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
• I/O Density — 488 I/O pins to accommodate broad connectivity requirements for peripherals, sensors, and interfaces.
• Power Supply — Core voltage range from 860 mV to 1.15 V to match low-voltage FPGA power domains and modern system rails.
• Package & Mounting — 780-BBGA (FCBGA) 29 × 29 supplier package in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for temperature-challenging environments.
• Compliance — RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Industrial Control Systems — Implement control logic and I/O aggregation where industrial temperature range and robust logic capacity are required.
• High-Density Digital Processing — Use the device’s 47,500 logic elements and ~2.18 Mbits of RAM for data processing, custom datapaths, and protocol handling.
• I/O-Intensive Interfaces — Leverage 488 I/Os to connect numerous sensors, actuators, and peripheral devices in embedded systems.
• System Integration and Prototyping — Surface-mount 780-FBGA package supports compact, board-level FPGA integration for development and production systems.

Unique Advantages

• High Logic Density: 47,500 logic elements enable implementation of complex logic functions without external ASICs or multiple devices.
• Substantial On-Chip Memory: Approximately 2.18 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O Count: 488 I/Os simplify board-level routing for multi-channel systems and rich peripheral connectivity.
• Industrial Temperature Support: Operation from −40 °C to 100 °C provides broader deployment options in temperature-sensitive environments.
• Compact Surface-Mount Package: 780-BBGA (29×29) FCBGA packaging enables high-density PCB layouts while maintaining manufacturability.
• RoHS Compliance: Meets environmental requirements for lead-free manufacturing and supply chain compatibility.

Why Choose EP3SL50F780I3N?

The EP3SL50F780I3N combines large-scale programmable logic, meaningful on-chip memory, and a high I/O count in a surface-mount 780-BBGA package, making it suitable for engineers designing compact, industrial-grade embedded systems. Its operating voltage range and temperature rating support integration into modern low-voltage platforms and temperature-challenging deployments.

This device is well suited for teams that need a scalable, high-density FPGA option for applications such as industrial controls, complex digital processing, and I/O-heavy interfaces, providing a balance of integration, capacity, and environmental robustness.

Request a quote or contact sales to discuss availability, pricing, and how EP3SL50F780I3N can fit your next design.