EP3SL50F780I4

The EP3SL50F780I4 is a Stratix® III L Field Programmable Gate Array (FPGA) IC offering a balance of logic density, embedded memory and I/O capacity in a 780-FBGA package. It is provided as an industrial-grade, surface-mount device with RoHS compliance.

Key device attributes include approximately 47,500 logic elements, roughly 2.18 Mbits of on-chip RAM, 488 user I/Os, a core supply range of 860 mV to 1.15 V, and an operating temperature range of −40 °C to 100 °C — packaged in a 780-FBGA (29×29) FCBGA footprint.

Key Features

• Logic Capacity  Approximately 47,500 logic elements to implement medium-to-high complexity digital functions.
• Embedded Memory  Approximately 2.18 Mbits of on-chip RAM for data buffering, state storage and memory-intensive logic.
• I/O Resources  488 I/O pins to support broad peripheral and bus interfacing without extensive external expansion.
• Power and Supply  Core supply range from 860 mV to 1.15 V to match system power domains and regulator choices.
• Package and Mounting  780-FBGA (29×29) FCBGA package, surface-mount for compact board-level integration.
• Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for deployments with extended temperature requirements.
• Compliance  RoHS-compliant manufacturing and materials.

Typical Applications

• High-density logic designs  Implement complex state machines, protocol bridges or custom datapaths using ~47,500 logic elements and on-chip RAM.
• High I/O interfacing  Designs that require extensive external connectivity can leverage the device’s 488 user I/Os for parallel interfaces, signal routing and peripheral attachment.
• Industrial systems  Industrial equipment and control systems can use the device’s industrial grade and −40 °C to 100 °C operating range to maintain operation across extended temperatures.

Unique Advantages

• Substantial logic density: Approximately 47,500 logic elements enable implementation of sophisticated custom logic and multiple concurrent functions on a single device.
• Significant on-chip RAM: Around 2.18 Mbits of embedded memory reduces reliance on external RAM for buffering and state storage.
• Extensive I/O count: 488 I/Os simplify system-level integration by accommodating many external signals directly on-chip.
• Compact BGA footprint: The 780-FBGA (29×29) package supports compact PCB designs while delivering high pin density.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in environments with wide thermal variation.
• RoHS-compliant: Conforms to RoHS requirements for lead-free assemblies.

Why Choose EP3SL50F780I4?

The EP3SL50F780I4 positions itself as a capable Stratix® III L FPGA option for designs that require a combination of substantial logic resources, meaningful on-chip memory and a high I/O count in a single industrial-grade package. Its 780-FBGA footprint and surface-mount form factor enable compact board-level integration while supporting a wide operating temperature range and RoHS compliance.

This device suits engineering teams building medium-to-high complexity digital systems that need integrated memory and abundant I/O without adding external components. Its specification set supports scalable designs where board density, I/O availability and temperature range are important selection criteria.

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