EP3SL50F780I3

The EP3SL50F780I3 is a Stratix® III L family Field Programmable Gate Array (FPGA) IC from Intel, provided in a 780-ball FCBGA package. It delivers a large logic fabric with abundant embedded memory and high I/O density designed for industrial-grade applications.

With approximately 47,500 logic elements, about 2.18 Mbits of on-chip RAM, and 488 I/O pins, this device is suited for complex, high-density digital designs that require extensive routing, memory buffering, and a wide operating temperature range.

Key Features

• FPGA Core  Stratix® III L field-programmable architecture with approximately 47,500 logic elements for complex logic implementation.
• Embedded Memory  Approximately 2.18 Mbits of on-chip RAM to support data buffering, state machines, and intermediate storage.
• I/O Capacity  488 user I/O pins to support a wide variety of external interfaces and parallel connectivity requirements.
• Power  Core voltage range of 0.86 V to 1.15 V to match low-voltage design domains and system power rails.
• Package  780-ball FCBGA (780-FBGA, 29×29) package for compact PCB footprint and high pin count integration; surface-mount mounting type.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature performance.
• Compliance  RoHS-compliant material and manufacturing status.

Typical Applications

• Industrial Control Systems  Implements complex control logic and interface aggregation where extended temperature range and industrial-grade components are required.
• Communications and Networking  Supports protocol processing and interface bridging with high logic density and abundant I/O for parallel and high-throughput connections.
• Embedded Signal Processing  Provides on-chip RAM and logic resources for buffering, data path implementation, and parallel processing in embedded data acquisition or signal conditioning systems.

Unique Advantages

• Significant Logic Capacity: Approximately 47,500 logic elements enable implementation of large, multi-function designs without external programmable logic.
• Substantial On-Chip Memory: About 2.18 Mbits of embedded RAM reduce dependency on external memory for many buffering and state storage tasks.
• High I/O Density: 488 I/O pins allow extensive connectivity to peripherals, sensors, and high-speed interfaces.
• Industrial-Grade Operation: Rated −40 °C to 100 °C to meet the thermal requirements of industrial deployments.
• Compact High-Pin Package: 780-ball FCBGA (29×29) packaging packs high functionality into a space-efficient surface-mount footprint.
• Low-Voltage Core Support: Core voltage range of 0.86 V to 1.15 V to accommodate contemporary low-voltage system architectures.

Why Choose EP3SL50F780I3?

The EP3SL50F780I3 combines a large logic fabric, ample embedded memory, and high I/O count in an industrial-grade FPGA package, making it a practical choice for designers building robust, high-density digital systems. Its thermal rating and RoHS compliance support deployment in demanding industrial environments.

This device is well suited to teams and projects that need significant on-chip resources and connectivity in a compact FCBGA form factor, offering a balance of integration and predictable electrical and thermal characteristics from a recognized FPGA family.

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