EP3SL50F780I3G

The EP3SL50F780I3G is a Stratix® III L field-programmable gate array (FPGA) in a 780-FBGA (29×29) surface-mount package, offered in an industrial temperature grade. It combines high logic density with substantial embedded memory and DSP resources for demanding high-performance logic, digital signal processing, and embedded system designs.

Built on the Stratix III family architecture, this device emphasizes power efficiency through Programmable Power Technology and selectable core voltage, while providing a broad set of clocking, I/O, and reliability features to support complex system integration.

Key Features

• Logic Capacity — 47,500 logic elements to implement complex custom logic and control functions.
• Embedded Memory — Approximately 2.18 Mbits of on-chip RAM (2,184,192 total RAM bits) for buffering, FIFOs, and local storage.
• I/O and Package — 488 user I/Os in a 780-FBGA (29×29) surface-mount package; modular I/O bank structure supports a wide range of I/O standards and signal integrity features.
• Power and Core Voltage — Programmable Power Technology and selectable core voltage with an operating supply range from 860 mV to 1.15 V to balance performance and power.
• Clocking and PLLs — Support for up to 16 global clocks, 88 regional clocks, 116 peripheral clocks and up to 12 PLLs for flexible clock management and synthesis.
• High-Performance DSP — Dedicated DSP blocks with support for multipliers (9×9, 12×12, 18×18, 36×36) suitable for FIR filters, MACs, and other DSP functions.
• High-Speed I/O & SERDES — High-speed differential I/O support with SERDES and dynamic phase alignment for serializer/deserializer applications (family-level support up to 1.6 Gbps).
• Reliability & Security — Optional 256-bit AES encryption for configuration security, CRC for configuration memory error detection, and ECC circuitry for on-chip memory error correction.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation, suitable for industrial environments.

Typical Applications

• High-Performance Logic — Implement complex control, state machines, and custom processing pipelines that require substantial logic density and deterministic behavior.
• Digital Signal Processing — Use dedicated DSP blocks and on-chip memory for FIR filters, multiply-accumulate operations, and other signal-processing workloads.
• Embedded Systems — Integrate processors, peripherals, and custom accelerators for embedded control and system integration tasks.
• Memory Interface and Buffering — Support high-speed external memory interfaces and large on-chip RAM for data buffering and interface logic.
• Communications & Networking — Implement protocol processing, SERDES-based links, and timing-critical networking functions leveraging modular I/O banks and clocking resources.

Unique Advantages

• High Integration: Combines 47,500 logic elements with approximately 2.18 Mbits of embedded memory, reducing external component count and simplifying board design.
• Flexible Power Management: Programmable Power Technology and selectable core voltage enable designers to tune for performance or power savings without changing device selection.
• Robust Clocking: Extensive clock resources and up to 12 PLLs allow precise timing architectures and multiple synchronous domains within a single device.
• Industry-Grade Operation: Industrial temperature rating (−40 °C to 100 °C) and surface-mount FCBGA packaging support deployment in rugged environments.
• Security & Reliability: Built-in AES configuration encryption options, CRC checks, and ECC on on-chip memory enhance product security and runtime reliability.

Why Choose EP3SL50F780I3G?

The EP3SL50F780I3G delivers a balanced combination of logic density, embedded memory, DSP capability, and flexible power options derived from the Stratix III L architecture. Its industrial temperature rating and robust I/O package make it a practical choice for systems that require sustained performance in challenging environments.

Engineers targeting high-performance logic, DSP acceleration, and integrated embedded solutions will find this device well suited for designs that demand scalability, configurability, and proven reliability backed by the Stratix III family feature set.

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