EP3SL50F780I4L

The EP3SL50F780I4L is an Intel Stratix® III L FPGA in a 780-ball FCBGA package, engineered for density and configurability in industrial designs. It provides a substantial logic fabric and embedded memory suitable for complex digital implementations that require large I/O counts and controlled operating conditions.

Designed for applications that require high logic capacity, significant on-chip RAM, and wide operating temperature support, this device offers a combination of integration and system-level flexibility while meeting RoHS environmental requirements.

Key Features

• Core Logic  Approximately 47,500 logic elements for implementing complex custom logic and control functions.
• Embedded Memory  Approximately 2.18 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Density  488 user I/O pins to accommodate high-pin-count interfaces, parallel buses, and system interconnects.
• Power  Core voltage supply specified from 860 mV to 1.15 V, enabling defined power domain design and supply planning.
• Package  780-ball BBGA / FCBGA package (supplier package listed as 780-FBGA, 29×29) for high-density board integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for a wide range of industrial environments.
• Compliance  RoHS compliant to support environmental and manufacturing requirements.

Typical Applications

• Industrial Control & Automation  Industrial-grade temperature support and substantial logic resources enable custom control, protocol bridging, and real-time processing in automated systems.
• High-Density I/O Systems  With 488 I/O pins, the device is suited to designs requiring many external interfaces such as multi-channel sensors, parallel buses, and modular I/O expansion.
• Embedded Memory-dependent Designs  Approximately 2.18 Mbits of embedded RAM support buffering and local data handling for applications like data aggregation and mid-level packet processing.

Unique Advantages

• High Logic Capacity: Approximately 47,500 logic elements provide the headroom for complex state machines, custom accelerators, and protocol implementations.
• Substantial On-chip Memory: Roughly 2.18 Mbits of embedded RAM reduces reliance on external memory for intermediate data storage, simplifying board-level BOM.
• Extensive I/O Count: 488 I/Os let designers consolidate multiple peripheral connections and reduce the need for external multiplexing or GPIO expanders.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in demanding environmental conditions common to industrial equipment.
• Compact High-Density Package: The 780-ball FCBGA (29×29) footprint enables high integration density for space-constrained PCBs.
• RoHS Compliance: Conforms to environmental manufacturing standards to facilitate compliant production flows.

Why Choose EP3SL50F780I4L?

The EP3SL50F780I4L positions itself as a high-capacity, industrial-grade FPGA option for designers seeking a balance of logic density, embedded memory, and extensive I/O in a single-package solution. Its operating temperature range and RoHS compliance make it suited for industrial applications where environmental robustness and regulatory conformity matter.

This device is appropriate for engineering teams building custom digital systems that require scalable logic resources, significant on-chip RAM, and a large number of external interfaces. Its package and electrical specifications allow straightforward board-level integration while helping to minimize external component count.

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