EP3SL70F484C2

The EP3SL70F484C2 is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, delivered in a 484-BBGA FCBGA package. It integrates 67,500 logic elements and approximately 2.7 Mbits of embedded memory to support complex programmable digital designs.

With 296 user I/O pins, a core voltage range of 860 mV to 1.15 V, and commercial-grade operation from 0 °C to 85 °C, this device is targeted at system designs that require high logic density and substantial on-chip RAM in a compact surface-mount package.

Key Features

• Core Logic  67,500 logic elements provide significant programmable logic capacity for complex designs.
• Embedded Memory  Approximately 2.7 Mbits of on-chip RAM (2,699,264 bits) for buffering, lookup tables, and data storage.
• I/O Capability  296 general-purpose I/O pins to support a wide range of external interfaces and signal routing.
• Package and Mounting  484-BBGA (484-FBGA, 23×23) FCBGA surface-mount package for compact board-level integration.
• Power  Core supply voltage range from 860 mV to 1.15 V to match target system power domains.
• Operating Temperature & Grade  Commercial grade operation across 0 °C to 85 °C, suitable for standard commercial applications.
• Standards Compliance  RoHS compliant for regulatory and environmental requirements.

Typical Applications

• Custom Digital Processing  Implement application-specific logic, data paths, and state machines using the device’s large logic resource pool.
• Memory-Intensive Algorithms  Leverage the approximately 2.7 Mbits of on-chip RAM for buffering, caching, and table-driven functions.
• High-Density I/O Systems  Use the 296 I/O pins for interfacing multiple peripherals, sensors, or parallel bus systems.
• Compact Board Designs  The 484-BBGA FCBGA package enables integration into space-constrained PCBs while maintaining high logic and memory capacity.

Unique Advantages

• High Logic Density: 67,500 logic elements enable large-scale programmable designs without partitioning across multiple devices.
• Substantial On-Chip RAM: Approximately 2.7 Mbits of embedded memory reduces external memory requirements and simplifies board layout.
• Generous I/O Count: 296 I/O pins support broad connectivity options and reduce the need for external multiplexing.
• Compact FCBGA Package: The 484-BBGA (23×23) footprint balances high integration with a small PCB area.
• Controlled Power Domain: 860 mV to 1.15 V core voltage range supports integration into modern power architectures.
• RoHS Compliant: Conforms to environmental compliance expectations for commercial electronics.

Why Choose EP3SL70F484C2?

The EP3SL70F484C2 positions itself as a high-density, memory-capable Stratix® III L FPGA option that combines substantial logic resources and on-chip RAM with a large I/O complement in a compact surface-mount FCBGA package. Its commercial operating range and RoHS compliance make it suitable for a wide array of standard commercial electronic designs.

Engineers and procurement teams seeking a single-device solution for complex programmable logic, sizeable embedded memory needs, and extensive external interfacing will find the EP3SL70F484C2 a clear, specification-driven choice backed by Intel manufacturing.

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