EP3SL70F484C2G

The EP3SL70F484C2G is a Stratix III L field-programmable gate array (FPGA) offered in a 484-FBGA (23×23) surface-mount package. The device provides a balanced mix of logic, embedded memory and DSP capability targeted at high-performance logic, digital signal processing and embedded system integration.

With 67,500 logic elements, approximately 2.7 Mbits of embedded RAM and 296 user I/O pins, this commercial-grade FPGA is suited for applications that require significant on-chip resources, flexible high-speed I/O and selectable core-voltage power scaling for performance versus efficiency trade-offs.

Key Features

• Logic Capacity — 67,500 logic elements for implementing complex combinational and sequential logic functions.
• Embedded Memory — Approximately 2.7 Mbits of on-chip RAM for frame buffers, FIFOs and other memory-intensive functions.
• High-speed DSP Support — Family-level DSP resources support dedicated multipliers (including 9×9, 12×12, 18×18 and 36×36 configurations) for multiply-accumulate and FIR filtering workloads at high clock rates.
• I/O and SERDES — 296 user I/O pins with modular I/O bank architecture, dynamic on-chip termination and high-speed differential I/O with SERDES/DPA circuitry supporting up to 1.6 Gbps signaling.
• Clocking and PLLs — Rich clocking resources with up to 16 global clocks, 88 regional clocks, 116 peripheral clocks and up to 12 phase-locked loops (PLLs) for flexible clock synthesis and distribution.
• Security and Reliability — Device-family support for 256-bit AES volatile and non-volatile configuration key options, CRC for configuration memory error detection and ECC protection for embedded memory blocks.
• Power and Voltage — Programmable Power Technology and selectable core voltage operation with a supply range of 860 mV to 1.15 V to balance performance and power consumption.
• Package and Grade — Surface-mount 484-BBGA (FCBGA) package (484-FBGA, 23×23); commercial temperature grade with an operating range of 0 °C to 85 °C. RoHS compliant.

Typical Applications

• High-performance signal processing — Implement FIR filters, FFTs and other DSP-heavy functions using the device’s dedicated multiplier blocks and abundant logic resources.
• Networking and communications — Use the high-speed differential I/O, SERDES and modular I/O banks for protocol implementation and packet processing at multi-gigabit interfaces.
• Memory interface controllers — Support for external memory interfaces (DDR/DDR2/DDR3 and other high-speed memories at the family level) combined with large on-chip RAM for buffering and timing-critical designs.
• Embedded systems and custom logic — Leverage the large logic element count and clocking resources to implement custom processors, accelerators and control logic within a single device footprint.

Unique Advantages

• Balanced resource mix: 67,500 logic elements and approximately 2.7 Mbits of embedded RAM deliver a mid-to-high density FPGA architecture suitable for combined logic and memory workloads.
• Flexible high-speed I/O: 296 user I/O and SERDES/DPA support enable diverse interface options and reliable signal integrity for high-bandwidth designs.
• Advanced clocking: Extensive global/regional/peripheral clocks and up to 12 PLLs simplify multi-clock-domain designs and clock synthesis requirements.
• Configurable power/performance: Selectable core voltage and programmable power features allow designers to tune the device for higher performance or lower power consumption.
• Security and data integrity: Support for 256-bit AES configuration keys, CRC for configuration memory and ECC for embedded RAM enhance design protection and runtime reliability.
• Commercial-grade package: Surface-mount 484-FBGA package provides a compact, manufacturable footprint for high-density system integration.

Why Choose EP3SL70F484C2G?

The EP3SL70F484C2G is positioned for designers who need a flexible, high-capacity FPGA with a balanced combination of logic, memory and DSP resources. Its extensive clocking and PLL options, robust I/O capabilities and configurable power modes make it well suited for demanding embedded, signal-processing and communications applications.

Choosing this Stratix III L device delivers a scalable platform with on-chip security and error-detection features that support long-term design robustness and system-level reliability, while the commercial-grade package and RoHS compliance simplify integration into mainstream product lines.

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