EP3SL70F484C3G

The EP3SL70F484C3G is a Stratix® III L field-programmable gate array (FPGA) in a 484‑ball BGA package designed for high-performance logic, DSP, and embedded system applications. It combines a large logic capacity with multi-megabit embedded memory and a comprehensive I/O and clocking architecture to support complex system integration and high-speed interfaces.

Built on the Stratix III device family architecture, this device targets designers who need a balance of logic, memory, and DSP resources while offering selectable core voltage and power-management features that help optimize performance and power consumption for commercial-grade applications.

Key Features

• Logic Capacity — 67,500 logic elements for implementing complex state machines, datapaths, and custom logic functions.
• Embedded Memory — Approximately 2.7 Mbits of on-chip RAM (2,699,264 total RAM bits) for FIFOs, buffers, and on-chip data storage.
• High‑Speed DSP — Family-level DSP blocks provide dedicated multipliers (9×9, 12×12, 18×18, and 36×36) and multiply-accumulate functions, supporting DSP operations at up to 550 MHz.
• I/O Density — 296 user I/O pins to interface with peripherals, memory, and external logic in modular I/O bank arrangements.
• Clocking and PLLs — Family supports up to 16 global clocks, 88 regional clocks, and 116 peripheral clocks, and up to 12 PLLs for flexible clock synthesis and distribution.
• High‑Speed I/O Features — Family-level support for SERDES, dynamic phase alignment, and dynamic on-chip termination to enable high-speed differential signaling and robust signal integrity.
• Power and Voltage — Selectable core voltage operation and Programmable Power Technology; device core supply range 860 mV to 1.15 V to balance performance and power.
• Package & Mounting — Surface-mount 484‑BBGA (484‑FBGA, 23×23) package for compact board integration.
• Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Security & Reliability — Family-level options include 256‑bit AES configuration bitstream security and on-chip CRC/ECC features for configuration and memory error detection and correction.
• RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

• High‑Performance Signal Processing — Implement FIR filters, multi-rate DSP pipelines, and accelerator functions using the device’s DSP multipliers and on-chip memory.
• Memory Interface Controllers — Use modular I/O banks and dedicated DQS logic to build DDR/DDR2/DDR3 and other high-speed memory interfaces.
• Networking & Communications — Leverage SERDES, dynamic phase alignment, and clocking resources to implement high-speed serial links and protocol bridging.
• Embedded System Integration — Combine logic, memory, and clocking resources to implement custom embedded processors, peripheral glue logic, and system controllers.

Unique Advantages

• Balanced Logic and Memory: 67,500 logic elements paired with ~2.7 Mbits of embedded RAM enable mixed compute-and-storage designs without large external memory dependencies.
• Dedicated DSP Resources: Built-in multiplier blocks and MAC capability reduce resource consumption for signal-processing algorithms and accelerate time-to-market.
• Flexible Clocking: Extensive global, regional, and peripheral clock resources plus multiple PLLs simplify multi-clock-domain designs and timing closure.
• Power Optimization: Selectable core voltage and Programmable Power Technology allow designers to tune performance vs. power for specific system needs.
• Robust I/O and Signal Integrity: Dynamic on-chip termination, SERDES support, and modular I/O banks help maintain signal integrity across a variety of high-speed interfaces.
• Commercial‑Grade Reliability: On-chip CRC and ECC features help detect and correct configuration and memory errors for improved system availability.

Why Choose EP3SL70F484C3G?

The EP3SL70F484C3G delivers a balanced combination of logic density, embedded memory, and DSP capability within a compact 484‑ball BGA package, making it well suited for designs that require complex processing, high-speed interfaces, and flexible clocking. Its selectable core voltage and family-level power-management features provide designers with options to optimize for performance or lower power consumption.

This Stratix III L FPGA is targeted at commercial applications needing scalable logic and memory resources, integrated DSP blocks, and a comprehensive I/O architecture. The device’s family-level security and reliability features, together with RoHS compliance, offer a practical platform for medium- to high-complexity systems that require long-term design support and ecosystem resources.

Request a quote or submit an inquiry to receive pricing and availability information for EP3SL70F484C3G. Our team can provide additional procurement details and support for integration planning.