EP3SL70F484C3N

The EP3SL70F484C3N is a Stratix® III L FPGA supplied in a 484-BBGA (FCBGA) surface-mount package. The device integrates 67,500 logic elements and approximately 2.7 Mbits of embedded memory, making it suitable for complex digital designs that require large logic capacity and on-chip RAM.

Designed for commercial-grade systems, the device provides 296 user I/O pins, programmable power options and support for high-speed I/O and DSP-oriented functions as detailed in the Stratix III device documentation. Typical system use cases include communications, high-performance signal processing, and embedded interface/control implementations.

Key Features

• Core Logic  67,500 logic elements (cells) for implementing large, high-density digital designs.
• Embedded Memory  Approximately 2.7 Mbits of on-chip RAM organized in TriMatrix embedded memory blocks for buffering, FIFOs and packet or data storage.
• I/O and Interfaces  296 device I/O pins and architecture-level support for high-speed differential I/O interfaces and external memory interfaces as described in the Stratix III family documentation.
• DSP and Timing  Device family features include DSP blocks and comprehensive clock networks with PLLs for synchronous, high-throughput signal processing (see device handbook).
• Configuration and Test  Supports standard configuration schemes and IEEE 1149.1 (JTAG) boundary-scan testing for board-level validation and in-system programming.
• Power  Specified core voltage supply range of 0.86 V to 1.15 V and programmable power options referenced in the device handbook.
• Package and Mounting  484-BBGA FCBGA package (supplier device package: 484-FBGA, 23×23); surface-mount for compact board integration.
• Operating Range and Grade  Commercial grade operation with an operating temperature range of 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Communications Infrastructure  Implements protocol processing, packet handling and interface bridging using the device’s high I/O count and on-chip memory.
• High-Performance Signal Processing  Leverages DSP blocks, clock networks and abundant logic elements for filtering, FFTs and real-time compute tasks.
• Embedded Systems and Prototyping  Supports complex control logic, custom peripherals and system integration in compact FCBGA form factors.
• Memory Interface Controllers  Enables external memory interface designs and buffering logic using embedded memory and dedicated I/O resources.

Unique Advantages

• High Logic Density: 67,500 logic elements provide capacity for complex state machines, datapaths and custom accelerators without external glue logic.
• Substantial On-Chip Memory: Approximately 2.7 Mbits of embedded RAM reduce dependency on external memory for buffering and temporary storage.
• Extensive I/O: 296 I/O pins support wide parallel interfaces and multiple high-speed serial/differential channels when used with the device family I/O features.
• Package Efficiency: 484-BBGA (FCBGA) surface-mount package enables compact board layouts and high pin density in a 23×23 supplier package footprint.
• Documented Platform: Part of the Stratix III family with comprehensive device handbook content covering architecture, DSP blocks, clocking, configuration and I/O capabilities.
• Commercial Readiness: Commercial-grade temperature rating (0 °C to 85 °C) and RoHS compliance support mainstream production and deployment.

Why Choose EP3SL70F484C3N?

The EP3SL70F484C3N positions itself as a high-capacity Stratix III L FPGA option for designers who need a balance of large programmable logic, substantial on-chip RAM and a high I/O count in a compact FCBGA package. Its documented family features—DSP blocks, advanced clock networks, and configurable I/O—help designers implement demanding digital and signal-processing applications.

This device is suited for teams building communications equipment, compute-accelerated embedded systems or memory-interface controllers who require a commercially rated, RoHS-compliant FPGA backed by the Stratix III device handbook and family documentation for design guidance and system integration.

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