EP3SL70F484C4L

The EP3SL70F484C4L is a Stratix® III L Field Programmable Gate Array (FPGA) in a 484-ball BGA (FCBGA) package. It provides a large programmable fabric with 67,500 logic elements and approximately 2.7 Mbits of embedded memory for complex digital designs.

With 296 I/O pins, a low core voltage range (0.86 V to 1.15 V), surface-mount packaging, and a commercial operating range of 0 °C to 85 °C, this device targets designs that require high logic density, significant on-chip memory, and a compact BGA footprint.

Key Features

• Core / Architecture  Stratix® III L FPGA architecture in a field-programmable device enabling custom digital logic implementation.
• Logic Capacity  67,500 logic elements to implement complex state machines, custom datapaths, and large combinational/sequential logic blocks.
• On‑Chip Memory  Approximately 2.7 Mbits of embedded RAM for buffering, lookup tables, and local data storage.
• I/O and Packaging  296 user I/O pins delivered in a 484-ball FBGA (23×23) package, optimized for high-density board designs and surface-mount assembly.
• Power  Core supply voltage range from 0.86 V to 1.15 V to match low-voltage system requirements.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Implement complex digital logic and custom processing pipelines using the device's 67,500 logic elements and embedded RAM.
• Prototyping and development  Use the programmable fabric and abundant I/O to validate hardware architectures and iterate system designs quickly.
• Embedded control and interfacing  Leverage the device's I/O count and on-chip memory for control logic, protocol bridging, and local buffering in embedded systems.

Unique Advantages

• High integration density: 67,500 logic elements reduce the need for discrete glue logic and external PLDs, simplifying board design.
• Substantial on-chip memory: Approximately 2.7 Mbits of embedded RAM supports buffering and local data storage, improving data throughput and latency.
• Large I/O complement: 296 I/O pins enable extensive external interfacing without additional I/O expanders.
• Compact BGA package: 484-ball FBGA (23×23) provides high pin-count in a compact surface-mount footprint for space-constrained boards.
• Low-voltage core support: Core supply range of 0.86 V to 1.15 V aligns with modern low-voltage power architectures.
• RoHS compliant: Facilitates regulatory alignment for commercial products.

Why Choose EP3SL70F484C4L?

The EP3SL70F484C4L combines a high logic element count and meaningful on-chip memory within a compact 484-BBGA package, making it suitable for designers who need substantial programmable capacity and plentiful I/O in a surface-mount form factor. Its low-voltage core and commercial temperature rating match common embedded system requirements.

This device is appropriate for development teams and OEMs building mid-to-high complexity digital systems who value integration, flexible I/O, and embedded memory to streamline designs and reduce external components.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the EP3SL70F484C4L.