EP3SL70F484I3

The EP3SL70F484I3 is a Stratix® III L field programmable gate array (FPGA) supplied in a 484-ball BGA FCBGA package. It provides a sizable programmable fabric with 67,500 logic elements and approximately 2.7 Mbits of embedded memory for mid-to-high density FPGA designs.

Designed for industrial-grade applications, the device features 296 I/O pins, a low-voltage core supply range (860 mV to 1.15 V), surface-mount packaging, and an operating temperature range of -40 °C to 100 °C—making it suitable for systems that require robust performance across temperature extremes.

Key Features

• Programmable Logic Capacity  67,500 logic elements provide extensive logic resources for complex digital designs and custom hardware acceleration.
• Embedded Memory  Approximately 2.7 Mbits of on-chip RAM to support buffering, FIFOs, and local storage without external memory for many use cases.
• I/O Count  296 user I/O pins to support a wide range of peripheral interfaces and board-level connectivity options.
• Power and Core Voltage  Core supply range of 860 mV to 1.15 V to match system power budgets and device power domains.
• Package and Mounting  484-BBGA (FCBGA) package, supplier device package 484-FBGA (23×23), and surface-mount mounting for dense PCB integration.
• Operating Temperature  Industrial-grade operation from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory Compliance  RoHS compliant, supporting lead-free assembly and environmental compliance requirements.
• Logic Array Blocks  2,700 logic array blocks (LABs) to structure and optimize large-scale logic implementations.

Unique Advantages

• HighLogic Density: 67,500 logic elements enable implementation of complex state machines, datapaths, and custom accelerators on a single device, reducing system-level component count.
• Substantial On‑Chip Memory: Approximately 2.7 Mbits of embedded RAM reduces dependency on external memory for many buffering and packet-processing tasks, simplifying board design.
• Flexible I/O Resources: 296 I/Os provide the pin count needed for multiple parallel interfaces, high-speed buses, and mixed-signal front-ends without additional I/O expanders.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to maintain operation in harsher environments, helping ensure system reliability across deployment conditions.
• Low-Voltage Core Support: Core supply from 860 mV to 1.15 V supports modern, power-conscious system architectures and enables compatibility with a variety of power management schemes.
• Compact Surface-Mount Package: The 484-BBGA FCBGA footprint and 23×23 FBGA supplier package enable dense PCB layouts and are suitable for space-constrained designs.

Why Choose EP3SL70F484I3?

The EP3SL70F484I3 balances substantial logic capacity and embedded memory with a high I/O count and industrial temperature tolerance, making it a solid choice for designers seeking an FPGA platform that supports complex, high-density digital designs. Its surface-mount 484-BBGA package and RoHS compliance simplify integration into modern production workflows.

This device is well suited for development teams and OEMs that require programmable flexibility, significant on-chip resources, and reliable operation across a wide temperature range—providing long-term value through reduced BOM complexity and scalability within Stratix® III L device families.

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