EP3SL70F484I3G

The EP3SL70F484I3G is a Stratix® III L field programmable gate array (FPGA) from Intel, delivered in a 484-ball FCBGA package (23×23). It provides a high logic density of 67,500 logic elements and approximately 2.7 Mbits of embedded RAM, along with 296 user I/Os.

Designed for industrial-grade applications, this surface-mount FPGA supports an operating temperature range of −40°C to 100°C and a core voltage supply range of 0.86 V to 1.15 V, addressing designs that require dense logic, substantial on-chip memory, and robust I/O capacity.

Key Features

• Core Logic 67,500 logic elements provide significant programmable logic capacity for complex digital designs.
• Embedded Memory Approximately 2.7 Mbits of on-chip RAM to support buffering, data storage, and state retention within the FPGA fabric.
• I/O Capacity 296 user I/Os to accommodate extensive peripheral, bus, and interface requirements.
• Power Core voltage supply range of 0.86 V to 1.15 V to match system power domains and regulator selections.
• Package & Mounting 484-ball FCBGA package (23×23) intended for surface-mount assembly, offering a compact footprint for board-level integration.
• Temperature & Grade Industrial-grade qualification with an operating range of −40°C to 100°C for deployment in demanding environments.
• RoHS Compliance Device is RoHS compliant.

Unique Advantages

• High Logic Density: 67,500 logic elements enable implementation of large-scale logic functions and complex algorithms on a single device.
• Substantial Embedded Memory: Approximately 2.7 Mbits of RAM reduce the need for external memory in many buffering and storage use cases.
• Extensive I/O Count: 296 I/Os support multiple parallel interfaces and mixed-signal front-end connections without immediate reliance on external expanders.
• Industrial Temperature Range: Rated from −40°C to 100°C to meet environmental requirements for industrial deployments.
• Flexible Power Window: Core supply range of 0.86 V–1.15 V offers compatibility with various power architectures.
• Compact Surface-Mount Package: 484-FBGA (23×23) package provides a dense, board-friendly solution for space-constrained systems.

Why Choose EP3SL70F484I3G?

The EP3SL70F484I3G combines large programmable logic capacity, substantial on-chip memory, and a high I/O count in an industrial-grade FCBGA package from Intel. Its specification set makes it suitable for designs that demand integrated logic and memory resources along with robust environmental performance.

This part is appropriate for engineering teams and procurement focused on scalable FPGA-based solutions that require dense logic, embedded RAM, and extensive I/O capability while operating across an industrial temperature range.

Request a quote or submit a pricing inquiry today to evaluate the EP3SL70F484I3G for your next design effort.