EP3SL70F484I4L

The EP3SL70F484I4L is a Stratix® III L field programmable gate array (FPGA) offered in a 484-BBGA FCBGA package. It delivers substantial on-chip logic and memory capacity alongside a high I/O count for complex, reconfigurable designs.

Designed for industrial-grade applications, this surface-mount FPGA supports a wide operating temperature range and a defined core voltage window, making it suitable for robust embedded and system-level implementations that require reconfigurable logic, ample embedded RAM, and extensive I/O.

Key Features

• Core Logic  67,500 logic elements for implementing complex combinational and sequential logic functions.
• Embedded Memory  Approximately 2.7 Mbits of on-chip RAM to support buffering, state storage, and local data handling.
• I/O Resources  296 general I/O pins to support multiple peripheral interfaces and dense system interconnects.
• Package & Mounting  484-BBGA FCBGA package (484-FBGA, 23×23) in a surface-mount form factor for compact PCB integration.
• Power  Core voltage supply range from 0.86 V to 1.15 V to match common core power schemes.
• Operating Range  Industrial-grade operation with an operating temperature range of −40 °C to 100 °C.

Typical Applications

• Industrial Control  Use the industrial temperature rating and extensive I/O to implement control logic, interface networks, and real-time control functions.
• Embedded Processing and Custom Logic  Deploy the device’s logic capacity and on-chip RAM for custom processing blocks, protocol handling, and specialized state machines.
• High‑I/O Systems  Leverage 296 I/O pins to connect multiple sensors, peripherals, or high-density board-level interfaces.

Unique Advantages

• High logic capacity: 67,500 logic elements allow consolidation of multiple functions within a single FPGA, reducing external component count.
• Substantial embedded memory: Approximately 2.7 Mbits of on-chip RAM enables local buffering and reduces external memory dependency for many designs.
• Robust industrial operation: Industrial-grade specification and −40 °C to 100 °C operating range support deployment in demanding environments.
• Extensive I/O availability: 296 I/O pins provide flexibility for complex interfacing and system integration tasks.
• Compact, surface-mount FCBGA package: 484-FBGA (23×23) package offers a space-efficient solution for board-level integration.
• Defined core voltage window: 0.86 V to 1.15 V supply range accommodates common core power schemes.

Why Choose EP3SL70F484I4L?

The EP3SL70F484I4L positions itself as a high-capacity, industrial-grade FPGA solution that balances large logic resources, significant embedded memory, and broad I/O in a compact FCBGA package. Its defined voltage range and extended operating temperature make it appropriate for reliable deployment in industrial and advanced embedded systems.

Designers seeking to integrate substantial programmable logic and on-chip RAM while maintaining space-efficient board layouts will find the EP3SL70F484I4L well suited to consolidate functionality, simplify BOMs, and support scalable, reconfigurable implementations.

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