EP3SL70F484I4LG

The EP3SL70F484I4LG is a Stratix® III L Field Programmable Gate Array (FPGA) supplied in a 484-FBGA (23×23) surface-mount package and rated for industrial temperature operation. It combines 67,500 logic elements with approximately 2.7 Mbits of on-chip memory and 296 user I/Os to address high-performance logic, DSP and embedded system designs.

Built on the Stratix III L architecture, this device offers selectable core voltage (0.86–1.15 V) and series-level power-management features to balance performance and power. Its mix of logic density, embedded memory and programmable I/O makes it suited for applications that require integration, configurability and industrial temperature operation.

Key Features

• Logic Density  67,500 logic elements for implementing complex digital logic and moderate to large-scale integration.
• Embedded Memory  Approximately 2.7 Mbits of on-chip RAM to implement buffers, FIFOs and local data storage without external memory.
• I/O and Package  296 user I/O pins in a 484-FBGA (23×23) package; surface-mount mounting for board-level integration and industrial deployment.
• Core Voltage and Power  Selectable core voltage range from 0.86 V to 1.15 V, enabling tradeoffs between throughput and power consumption.
• Clocking and PLLs  Series-level support for multiple global and regional clocks and up to 12 PLLs for clock synthesis and flexible timing architectures.
• High-Speed DSP Capabilities  Stratix III family DSP blocks and multiplier support as described in the device family handbook for signal-processing implementations.
• Memory Interface Support  Device family support for memory interfaces with dedicated DQS logic and dynamic on-chip termination for robust external SDRAM and related interfaces.
• Security and Reliability  Series features include optional 256-bit AES encryption and configuration memory CRC/ECC mechanisms for error detection and correction.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.

Typical Applications

• High-performance digital signal processing  Implements DSP pipelines and multiplier-intensive algorithms using the device's dedicated DSP resources and on-chip memory.
• Telecommunications and networking  Supports high-speed I/O and memory-interface features for packet processing, protocol offload and line-rate interfacing.
• Memory controller and interface logic  Integrates memory timing, DQS support and on-chip buffering for DDR/DDR2/DDR3 interface implementations.
• Embedded system integration  Combines programmable logic, on-chip RAM and I/O to implement custom peripherals, protocol bridges and embedded accelerators.

Unique Advantages

• High integration in a single device: 67,500 logic elements and ~2.7 Mbits of embedded RAM reduce external components and simplify board design.
• Flexible power-performance tradeoffs: Selectable core voltage (0.86–1.15 V) allows designers to tune for lower power or higher performance depending on system needs.
• Industrial-ready operation: Specified −40 °C to 100 °C operating range and surface-mount FBGA package support deployment in industrial environments.
• Built-in reliability and security: Configuration CRC/ECC and optional 256-bit AES encryption provide mechanisms for configuration integrity and IP protection.
• Comprehensive clocking and DSP support: Multiple clock domains, PLLs and DSP blocks enable complex timing architectures and high-throughput signal processing.

Why Choose EP3SL70F484I4LG?

EP3SL70F484I4LG positions itself as a balanced, industrial-grade FPGA option within the Stratix® III L family for engineers who need substantial logic capacity, embedded memory and flexible I/O in a single component. Its selectable core voltage and series-level power-management features let designers tailor power and performance to the application, while on-chip memory, DSP resources and robust clocking capabilities support demanding logic and signal-processing tasks.

This device is suited for system designers building communications, networking, embedded processing and memory-interface solutions that require integration, configurability and operation over an industrial temperature range. Support for embedded processors and megafunctions described in the device family handbook helps reduce development time and reuse IP across designs.

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