EP3SL70F484I4N

The EP3SL70F484I4N is a Stratix® III L field programmable gate array (FPGA) IC from Intel, supplied in a 484-FBGA (23×23) surface-mount package. It delivers a high-density programmable fabric with 67,500 logic elements, approximately 2.699 Mbits of embedded memory, and 296 user I/O pins, targeted at industrial applications requiring robust operating temperature and supply ranges.

Key Features

• Logic Capacity — 67,500 logic elements provide substantial programmable logic resources for complex custom designs.
• Embedded Memory — Approximately 2.699 Mbits of on-chip RAM for buffering, LUT-based storage, and local data handling.
• I/O Density — 296 user I/O pins to support a wide range of external interfaces and parallel connections.
• Power Supply — Core supply range from 0.86 V to 1.15 V to match system power-rail designs.
• Package & Mounting — 484-ball FCBGA package (23×23) optimized for surface-mount assembly and compact board layouts.
• Industrial Temperature Grade — Specified operating range from −40 °C to 100 °C to support industrial environments.
• Standards Compliance — RoHS compliant, meeting common environmental requirements for lead-free assembly.

Typical Applications

• Industrial Automation — Use the FPGA’s logic and I/O capacity to implement custom control and interface functions that run across an industrial temperature range.
• Communications Equipment — High logic density and significant embedded memory support protocol handling, framing, and buffer management in communications gear.
• Test & Measurement — Compact FCBGA packaging and numerous I/Os enable integration of custom signal processing and data acquisition logic on compact PCBs.

Unique Advantages

• High Logic Integration: 67,500 logic elements reduce the need for multiple discrete devices and simplify board-level design.
• On‑Chip Memory: Approximately 2.699 Mbits of embedded RAM supports local buffering and state storage without immediate external memory.
• Rich I/O Count: 296 I/O pins enable flexible connectivity for parallel interfaces, sensors, and external peripherals.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in harsh or temperature-variable environments.
• Compact, Surface-Mount Package: 484-FBGA (23×23) provides a space-efficient footprint for high-density board layouts.
• Regulatory Compliance: RoHS compliant for lead-free manufacturing flows.

Why Choose EP3SL70F484I4N?

The EP3SL70F484I4N positions itself as a high-density, industrial-grade FPGA option within the Stratix® III L family, offering a balance of logic capacity, embedded memory, and I/O density in a compact 484-FBGA package. Its specified core voltage range and wide operating temperature band make it suitable for designers building robust, long-lived systems that require substantial on-chip resources.

This device is ideal for engineers and procurement teams designing industrial automation, communications, or measurement products that need scalable programmable logic from a recognized FPGA family. The combination of logic elements, on-chip RAM, and I/O flexibility delivers integration and board-level simplification while meeting environmental compliance requirements.

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