EP3SL70F780C3

The EP3SL70F780C3 is a Stratix® III L Field Programmable Gate Array manufactured by Intel. This surface-mount FPGA provides a high number of logic elements and on-chip memory for implementable programmable logic designs.

Key characteristics include 67,500 logic elements, approximately 2.7 Mbits of embedded memory, and 488 I/O pins, packaged in a 780-FBGA (29×29) package and intended for commercial-temperature applications.

Key Features

• Logic Capacity — 67,500 logic elements for implementing complex digital logic and custom architectures.
• Embedded Memory — Approximately 2.7 Mbits of total RAM bits available for on-chip buffering, state storage, and local data processing.
• I/O Density — 488 I/O pins to support multiple external interfaces and parallel connections.
• Package — 780-FBGA (29×29) surface-mount package (780‑BBGA, FCBGA) for compact board-level integration.
• Power — Core voltage supply range of 0.86 V to 1.15 V to match compatible system power domains.
• Operating Temperature — Commercial-grade temperature range from 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• Custom digital logic — Implement application-specific logic functions and state machines using the device's large logic element count and embedded memory.
• Interface bridging and I/O expansion — High I/O count enables bridging between multiple buses or expanding interface capability on a single device.
• Prototyping and development — Dense logic and on-chip RAM make this FPGA suitable for hardware prototyping and iteration of digital designs.

Unique Advantages

• High logic density: 67,500 logic elements provide the capacity to implement complex designs without immediately scaling to larger devices.
• Significant on-chip RAM: Approximately 2.7 Mbits of embedded memory reduces dependency on external memory for many buffer and state needs.
• Large I/O complement: 488 I/O pins support multiple external interfaces and parallel data paths directly from the FPGA.
• Compact FBGA package: 780‑FBGA (29×29) surface-mount packaging enables high-density board designs while maintaining thermal and mechanical reliability for commercial applications.
• Low-voltage core support: 0.86–1.15 V supply range accommodates low-voltage system power architectures.

Why Choose EP3SL70F780C3?

The EP3SL70F780C3 combines a large logic element count with substantial on-chip memory and a high I/O count in a compact 780-FBGA surface-mount package, making it suitable for designs that require dense programmable logic and significant local memory. Manufactured by Intel, this commercial-grade FPGA targets applications where board-level integration, pin count, and logic capacity are primary considerations.

Choose this device when your design requires a balance of logic resources, embedded RAM, and extensive I/O in a RoHS-compliant, commercially rated FPGA package.

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