EP3SL70F780C3NAC
| Part Description |
Stratix® III L Field Programmable Gate Array (FPGA) IC 488 2699264 67500 780-BBGA, FCBGA |
|---|---|
| Quantity | 584 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2700 | Number of Logic Elements/Cells | 67500 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 2699264 |
Overview of EP3SL70F780C3NAC – Stratix® III L FPGA, 67,500 logic elements, 488 I/Os, 780-FBGA (29×29)
The EP3SL70F780C3NAC is a Stratix III L field programmable gate array (FPGA) optimized for balanced logic, memory, and multiplier ratios in mainstream high-performance designs. It combines a high logic count and substantial embedded memory with advanced on-chip power controls and security features drawn from the Stratix III device family.
This surface-mount FCBGA package (780-BBGA, supplier package 780-FBGA 29×29) provides 488 user I/Os and operates from a core supply range of 860 mV to 1.15 V with an ambient operating temperature of 0 °C to 85 °C, suitable for commercial-grade applications requiring programmable logic, DSP and embedded processing capability.
Key Features
- Logic Density 67,500 logic elements for implementing complex control, DSP and custom logic functions.
- Embedded Memory Approximately 2.7 Mbits of on-chip RAM (2,699,264 bits) to support buffers, FIFOs and local storage.
- I/O and High-Speed Interfaces 488 user I/Os in a modular bank structure; family-level support includes high-speed differential I/O with SERDES and dynamic phase alignment for up to 1.6 Gbps signaling.
- Clocking and Timing Series-level resources include up to 16 global clocks and up to 12 phase-locked loops (PLLs) for flexible clock management and synthesis.
- Programmable Power and Core Voltage Selectable core voltage and Programmable Power Technology (series-level) to balance performance and power across functional blocks; device core supply range: 860 mV to 1.15 V.
- Security and Reliability Series-level features include optional 256-bit AES configuration encryption, CRC for configuration memory checking, and ECC for on-chip memory blocks to detect and correct errors.
- Package & Mounting 780-BBGA FCBGA package (supplier: 780-FBGA 29×29), surface mount, RoHS compliant, commercial grade with operating range 0 °C to 85 °C.
Typical Applications
- High-Performance Logic & DSP Implement complex processing pipelines and multiply-accumulate workloads using the device’s high logic count and series-level DSP resources.
- Embedded Systems Integrate custom control, interface logic and local memory for embedded applications that benefit from reprogrammable hardware.
- Networking & Communications Use high-speed differential I/O and SERDES capabilities for protocol processing and data-plane functions in communication equipment.
- Memory Interface Controllers Leverage series-level memory-interface support and on-chip RAM to build controllers and buffering for external DDR and SRAM memories.
Unique Advantages
- Balanced logic and memory combination: 67,500 logic elements paired with approximately 2.7 Mbits of embedded RAM supports mixed logic and buffering tasks without excessive external memory.
- Flexible I/O for system integration: 488 user I/Os in a modular bank package accommodate diverse interface standards and reduce board-level complexity.
- Configurable power/performance: Selectable core voltage and series-level programmable power features enable designers to tune performance versus power for targeted use cases.
- Security and data integrity: Series-level AES configuration encryption, CRC checks and ECC-protected memory help protect design IP and maintain runtime data integrity.
- Commercial-package convenience: 780-BBGA (29×29) surface-mount package provides a compact, manufacturable form factor with RoHS compliance for commercial production.
Why Choose EP3SL70F780C3NAC?
The EP3SL70F780C3NAC positions itself as a versatile Stratix III L FPGA option for designers who need substantial logic capacity, meaningful on-chip RAM, and robust I/O in a commercial-grade FCBGA package. Its selectable core voltage and family-level power management features allow tuning between performance and power consumption to match application requirements.
Ideal for engineers building high-performance logic, DSP-accelerated processing, memory interface controllers and communications hardware, this device offers a balance of integration, security features and system-level clocking resources that support scalable, reprogrammable hardware designs.
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