EP3SL70F780C4L

The EP3SL70F780C4L is a Stratix® III L FPGA in a 780-BBGA FCBGA package designed for commercial-grade digital designs. It provides 67,500 logic elements, approximately 2.7 Mbits of on-chip RAM, and up to 488 user I/O for mid-range system integration and complex logic implementations.

With a core supply range of 0.86–1.15 V and an operating temperature range of 0 °C to 85 °C, this surface-mount FPGA balances integration and power flexibility for commercial electronic applications that require substantial logic capacity and significant embedded memory.

Key Features

• Core Architecture 67,500 logic elements provide the programmable fabric needed for complex combinational and sequential logic functions.
• Embedded Memory Approximately 2.7 Mbits of total on-chip RAM to support buffering, lookup tables, and intermediate data storage within designs.
• I/O Capacity Up to 488 user I/O pins enable broad interfacing to peripherals, sensors, and external devices in varied system topologies.
• Power Core voltage supply range of 0.86–1.15 V supports flexible power budgeting and integration with common commercial power rails.
• Package and Mounting 780-BBGA (FCBGA) surface-mount package, supplier package: 780-FBGA (29×29), suitable for compact board layouts that require a high pin count.
• Operating Range and Grade Commercial grade device rated for 0 °C to 85 °C operation; RoHS compliant.

Typical Applications

• Embedded system prototyping — Use the EP3SL70F780C4L to implement and validate mid-range digital designs that require tens of thousands of logic elements and on-chip RAM.
• Data buffering and control — The approximately 2.7 Mbits of embedded memory supports local buffering and temporary storage in control and data-path applications.
• Multi-I/O interfacing — With up to 488 I/O, the device fits designs that require extensive peripheral connectivity or multiple parallel interfaces.

Unique Advantages

• Substantial logic capacity: 67,500 logic elements enable implementation of complex logic functions without immediate migration to larger devices.
• On-chip memory for integrated buffering: Approximately 2.7 Mbits of RAM reduces dependence on external memory for many mid-range tasks, simplifying board design.
• High I/O count: 488 user I/O pins provide flexibility for multi-channel interfaces and dense peripheral connections.
• Compact high-pin-count package: 780-BBGA (29×29) FCBGA delivers high connectivity in a compact surface-mount footprint for space-constrained PCBs.
• Commercial operating range: Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronic products and development platforms.
• RoHS compliant: Meets common environmental compliance requirements for commercial manufacturing.

Why Choose EP3SL70F780C4L?

The EP3SL70F780C4L positions itself as a capable commercial-grade FPGA offering a balance of logic density, embedded memory, and a high I/O count within a compact 780-BBGA package. Its electrical and thermal ratings make it appropriate for mid-range digital designs that require substantial on-chip resources without moving to larger device families.

This device is well suited to engineering teams and procurement departments seeking a programmable logic solution that integrates significant logic capacity and memory with broad I/O connectivity in a surface-mount form factor.

If you would like pricing or availability, request a quote or submit a quote request to receive further commercial details and lead-time information.