EP3SL70F780C4LN

The EP3SL70F780C4LN is a Stratix® III L Field Programmable Gate Array (FPGA) offered by Intel. It provides a high-density, commercial-grade programmable logic fabric with a large complement of logic elements, embedded memory, and general-purpose I/O for complex digital designs.

This device is suited for applications that require substantial on-chip logic and memory resources packaged in a surface-mount FCBGA. Key value stems from its high logic capacity, sizable embedded memory, and comprehensive I/O count in a 780-ball BGA package.

Key Features

• Core Logic 67,500 logic elements provide the capacity to implement complex custom digital functions and parallel processing pipelines.
• Embedded Memory Approximately 2.7 Mbits of on-chip RAM to store intermediate data, buffers, and lookup tables for real-time processing tasks.
• I/O Capacity 488 general-purpose I/O pins to support broad interfacing requirements with external peripherals, buses, and I/O standards.
• Package & Mounting Supplied in a 780-ball BGA (780-BBGA, FCBGA) with a supplier device package of 780-FBGA (29×29) designed for surface-mount assembly.
• Power Operating core voltage range from 860 mV to 1.15 V to match platform power budgets and supply rails.
• Temperature & Grade Commercial-grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant, meeting common lead-free and hazardous substance requirements.

Typical Applications

• Custom digital logic and prototyping — Use the device’s 67,500 logic elements and programmable fabric to implement and iterate custom logic architectures and prototype system functionality.
• High-density I/O control — With 488 I/O pins, the FPGA can aggregate and manage multiple external interfaces, sensors, or parallel data streams.
• Embedded data buffering and processing — Approximately 2.7 Mbits of embedded memory support local buffering, FIFOs, and lookup tables for real-time data handling needs.

Unique Advantages

• High logic capacity: 67,500 logic elements enable implementation of large-scale, custom digital designs without immediate need for external logic.
• Substantial on-chip memory: Approximately 2.7 Mbits of embedded RAM reduce dependence on external memory for intermediate data storage and accelerate data-path operations.
• Large I/O count: 488 I/O pins simplify system partitioning by providing abundant direct interfaces to peripherals and external components.
• Compact BGA packaging: 780-ball FCBGA (29×29) provides a high-density, surface-mount form factor suitable for space-constrained boards.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with mainstream embedded and consumer product environments.
• RoHS compliant: Complies with lead-free and hazardous substance directives for environmentally conscious designs.

Why Choose EP3SL70F780C4LN?

The EP3SL70F780C4LN positions itself as a high-density commercial FPGA option within the Stratix® III L family, offering a balance of extensive logic resources, embedded memory, and broad I/O in a compact FCBGA package. Its voltage and temperature specifications make it suitable for mainstream embedded designs that require substantial programmable logic capability.

This part is well suited to engineering teams designing complex custom logic, high-density I/O interfaces, or systems that benefit from significant on-chip buffering and processing. Selecting this device supports designs that need scalability in logic and memory while maintaining a compact, surface-mount footprint.

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