EP3SL70F780I3G

The EP3SL70F780I3G is a Stratix® III L Field Programmable Gate Array (FPGA) IC designed for high-performance, programmable logic and signal-processing tasks. Built on the Stratix III family architecture, this device targets applications that require a balance of logic, embedded memory, and multiplier resources.

With 67,500 logic elements, approximately 2.7 Mbits of embedded RAM, and 488 user I/Os in a 780-ball FCBGA package, the device provides a compact, industrial-grade programmable platform optimized for DSP, high-speed I/O, and complex system integration.

Key Features

• Core Logic — 67,500 logic elements for implementing complex custom logic, control, and processing functions.
• Embedded Memory — Approximately 2.7 Mbits of on-chip RAM for FIFOs, buffers, and storage of intermediate data without external memory.
• High-density I/O — 488 user I/Os arranged to support modular I/O bank architectures and a wide range of signaling requirements.
• DSP and Multiplier Support (Series Feature) — Stratix III family includes high-speed DSP blocks and dedicated multipliers for multiply-accumulate and FIR filtering tasks, enabling efficient signal-processing implementations.
• High-speed Interfaces (Series Feature) — Family-level support for SERDES, dynamic phase alignment (DPA), and high-speed differential I/O for multi-gigabit link implementations.
• Power and Voltage — Selectable core voltage operation with a supply range of 860 mV to 1.15 V to support different performance and power trade-offs.
• Package and Mounting — 780-BBGA (FCBGA) package, supplier package 780-FBGA (29×29), surface-mount mounting for high-density board designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Security and Reliability (Series Feature) — Stratix III family provides optional 256-bit AES encryption for configuration bitstream security and built-in configuration memory error detection mechanisms.
• Compliance — RoHS-compliant construction.

Typical Applications

• High-speed networking and communications — Implement packet processing, protocol bridging, and multi-gigabit interfaces using the device's high-density logic, SERDES-capable I/O, and clocking resources.
• Signal processing and DSP systems — Deploy FIR filters, FFTs, and MAC-intensive algorithms leveraging the Stratix III family’s dedicated DSP and multiplier resources.
• Memory interface controllers — Implement controllers and PHYs for DDR, DDR2, DDR3 and other external memory interfaces using the device’s modular I/O bank structure and dedicated memory interface support.
• Embedded and custom logic — Integrate control, interfaces, and accelerator functions on a single programmable device to reduce board-level complexity and BOM.

Unique Advantages

• High integration density: 67,500 logic elements combined with ~2.7 Mbits of embedded RAM and 488 I/Os reduce the need for multiple discrete components.
• Flexible performance/power trade-offs: Selectable core voltage (860 mV–1.15 V) enables tuning for either higher performance or lower power operation.
• Industrial-grade robustness: Rated for −40 °C to 100 °C operation and supplied in a 780-FBGA package for reliable deployment in industrial systems.
• Security and fault detection: Family-level support for 256-bit AES configuration encryption and configuration memory error detection enhances system security and reliability.
• Compact package for dense designs: 780-ball FCBGA (29×29) footprint supports high pin-count designs in a space-efficient form factor.

Why Choose EP3SL70F780I3G?

The EP3SL70F780I3G combines substantial logic capacity, embedded memory, and a high I/O count in an industrial-grade FCBGA package, making it suitable for systems that require programmable acceleration, high-speed interfaces, and on-chip buffering. Its Stratix III family features—such as selectable core voltage, DSP support, and configuration security—provide flexible design options for engineers balancing performance, power, and integration.

This part is appropriate for designers building networked communications equipment, DSP-heavy embedded systems, and memory-interface controllers who need a scalable, programmable platform backed by the Stratix III device family capabilities.

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