EP3SL70F780I4G

The EP3SL70F780I4G is a Stratix® III L Field Programmable Gate Array (FPGA) offered in a compact 780-ball package. It integrates 67,500 logic elements and approximately 2.7 Mbits of embedded memory to support complex programmable logic and on-chip data buffering.

Designed for industrial-grade deployments, this surface-mount FPGA provides a broad I/O count and a defined operating range, making it suitable for applications that require substantial logic capacity, significant embedded RAM, and reliable operation across a wide temperature range.

Key Features

• Configurable Logic Blocks (CLBs) — 2,700 CLBs providing a total of 67,500 logic elements for sizable custom logic implementations.
• Embedded Memory — Approximately 2.7 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-mapped functions.
• I/O Density — 488 user I/O pins to accommodate multiple external interfaces and parallel connectivity needs.
• Power Supply — Core voltage range of 860 mV to 1.15 V to match platform power design requirements.
• Package & Mounting — 780-ball BGA package; supplier device package listed as 780-FBGA (29×29), surface-mount for compact board integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in temperature-demanding environments.
• Regulatory Compliance — RoHS compliant to support environmentally conscious procurement and manufacturing.

Unique Advantages

• Large Logic Capacity: 67,500 logic elements enable complex programmable designs without spreading functionality across multiple devices.
• Significant On-Chip Memory: Approximately 2.7 Mbits of embedded RAM reduces the need for external memory for many buffering and data-path tasks.
• High I/O Count: 488 I/O pins provide flexibility to interface with multiple peripherals, sensors, and parallel data streams.
• Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployments in industrial and temperature-variable environments.
• Compact Integration: 780-ball BGA in a 29×29 supplier package supports dense, surface-mount PCB layouts for space-constrained designs.
• RoHS Compliance: Environmentally compliant manufacturing and supply chain compatibility.

Why Choose EP3SL70F780I4G?

The EP3SL70F780I4G positions itself as a high-capacity Stratix® III L FPGA option for engineers needing substantial programmable logic, embedded RAM, and a broad I/O footprint in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for designs that demand durability and regulatory alignment.

This device is appropriate for design teams seeking a single-chip solution to consolidate logic, reduce external memory dependence, and integrate multiple interfaces while maintaining a surface-mount form factor for streamlined PCB assembly and lifecycle support.

Request a quote or submit a pricing and availability inquiry to evaluate EP3SL70F780I4G for your next design project.